In this paper, electrical characteristic analysis and corresponding experimental tests on gold
bonding wire are presented. Firstly, according to EIA (Electronic Industries …

This book deals with the analysis and development of numerical methods for the time-
domain analysis of multiphysical effects in superconducting circuits of particle accelerator …

Classified information may be derivable from unintended electromagnetic signals. This
article presents a technical analysis of LED arrays used in monochrome computer printers …

The FP7 project nanoCOPS derives new methods for simulation during development of
designs of integrated products. It covers advanced simulation techniques for …

We apply the proper generalized decomposition (PGD) to a static electrothermal model
subject to uncertainties. The quadratic electrothermal coupling term is non-standard and …

The temperature developed in bondwires of integrated circuits (ICs) is a possible source of
malfunction and has to be taken into account during the design phase of an IC. Because of …

Existing electrical-thermal cosimulation methods require solving a system matrix when
handling inhomogeneous materials and irregular geometries discretized into unstructured …

We present a method for the automatic generation of netlists describing general three-
dimensional electrothermal and electromagnetic field problems. Using a pair of structured …

This work addresses the simulation of heat flow and electric currents in thin wires. An
important application is the use of bond wires in microelectronic chip packaging. The heat …

All devices in the power grid have to withstand high short-time currents, that may occur as a
consequence of short-circuits. The thermally critical areas during short-circuit testing of …