Electromigration in submicron interconnect features of integrated circuits

H Ceric, S Selberherr - Materials Science and Engineering: R: Reports, 2011 - Elsevier
Electromigration (EM) is a complex multiphysics problem including electrical, thermal, and
mechanical aspects. Since the first work on EM was published in 1907, extensive studies on …

[CARTE][B] Introduction to micromechanics and nanomechanics

S Li, G Wang - 2008 - books.google.com
This book provides both the theoretical foundation, as well as the authors' latest
contributions to micromechanics and its applications in nanomechanics, nanocomposites …

Elastic modeling of point-defects and their interaction

E Clouet, C Varvenne, T Jourdan - Computational Materials Science, 2018 - Elsevier
Different descriptions used to model a point-defect in an elastic continuum are reviewed.
The emphasis is put on the elastic dipole approximation, which is shown to be equivalent to …

Advances in ion beam modification of semiconductors

RG Elliman, JS Williams - Current Opinion in Solid State and Materials …, 2015 - Elsevier
This review provides an overview of the current status of ion-implantation research in silicon,
germanium and the compound semiconductors SiC, GaN and ZnO. The discussion of silicon …

Effect of stress on vacancy formation and migration in body-centered-cubic metals

PW Ma, SL Dudarev - Physical Review Materials, 2019 - APS
Vacancy formation and migration control self-diffusion in pure crystalline materials, whereas
irradiation produces high concentrations of vacancy and self-interstitial atom defects …

Diffusivity and derivatives for interstitial solutes: activation energy, volume, and elastodiffusion tensors

DR Trinkle - Philosophical Magazine, 2016 - Taylor & Francis
Computational atomic-scale methods continue to provide new information about geometry,
energetics and transition states for interstitial elements in crystalline lattices. This data can …

Pressure and stress effects on the diffusion of B and Sb in Si and Si-Ge alloys

MJ Aziz, Y Zhao, HJ Gossmann, S Mitha, SP Smith… - Physical Review B …, 2006 - APS
The hydrostatic pressure dependence of the diffusivity of B and Sb in Si and of B in Si 89 Ge
11 has been measured. The diffusivity of Sb in Si is retarded by pressure, characterized by …

Stress-induced anisotropic diffusion in alloys: Complex Si solute flow near a dislocation core in Ni

T Garnier, VR Manga, DR Trinkle, M Nastar… - Physical Review B …, 2013 - APS
Stress introduces anisotropy in the transport coefficients in materials, affecting diffusion.
Using first-principles quantum-mechanical methods for activation barriers of atomic jumps …

Physical modeling and implementation scheme of native defect diffusion and interdiffusion in SiGe heterostructures for atomistic process simulation

P Castrillo, R Pinacho, M Jaraiz, JE Rubio - Journal of Applied Physics, 2011 - pubs.aip.org
In order to simulate the diffusion kinetics during thermal treatments in SiGe heterostructures,
a physically-based atomistic model including chemical and strain effects has been …

Front-end process modeling in silicon

L Pelaz, LA Marqués, M Aboy, P López… - The European Physical …, 2009 - Springer
Front-end processing mostly deals with technologies associated to junction formation in
semiconductor devices. Ion implantation and thermal anneal models are key to predict …