Hybrid epoxy composites with both powder and fiber filler: a review of mechanical and thermomechanical properties
D Matykiewicz - Materials, 2020 - mdpi.com
Fiber-reinforced epoxy composites are used in various branches of industry because of their
favorable strength and thermal properties, resistance to chemical and atmospheric …
favorable strength and thermal properties, resistance to chemical and atmospheric …
[HTML][HTML] Manufacturing Technology of Lightweight Fiber-Reinforced Composite Structures in aerospace: current situation and toward intellectualization
Lightweight fiber-reinforced composite structures have been applied in aerospace for
decades. Their mechanical properties are crucial for the safety of aircraft and mainly depend …
decades. Their mechanical properties are crucial for the safety of aircraft and mainly depend …
Enhanced epoxy/silica composites mechanical properties by introducing graphene oxide to the interface
L Chen, S Chai, K Liu, N Ning, J Gao… - … applied materials & …, 2012 - ACS Publications
Controlling the interface interaction of polymer/filler is essential for the fabrication of high-
performance polymer composites. In this work, a core–shell structured hybrid (SiO2–GO) …
performance polymer composites. In this work, a core–shell structured hybrid (SiO2–GO) …
[HTML][HTML] High-performance epoxy/binary spherical alumina composite as underfill material for electronic packaging
In this study, epoxy (EP)/binary spherical alumina (S-Al 2 O 3) composites with a high
loading of 50 vol% were fabricated by incorporating different sizes of S-Al 2 O 3 into EP to …
loading of 50 vol% were fabricated by incorporating different sizes of S-Al 2 O 3 into EP to …
[HTML][HTML] Synergetic effect of hybrid fillers of boron nitride, graphene nanoplatelets, and short carbon fibers for enhanced thermal conductivity and electrical resistivity of …
High filler loading in polymer alone cannot meet the increasing requirements of the
electronic industry, so the hybrid fillers with unique advantages have been developed. In this …
electronic industry, so the hybrid fillers with unique advantages have been developed. In this …
Effect of nano TiO2 particle size on mechanical properties of cured epoxy resin
HA Al-Turaif - Progress in Organic Coatings, 2010 - Elsevier
Mechanical properties of toughened epoxy resin with two nano particles sizes of TiO2 (17nm
and 50nm) at different weight fractions (1%, 3%, 5% and 10%) were investigated and …
and 50nm) at different weight fractions (1%, 3%, 5% and 10%) were investigated and …
Effect of epoxy modifiers (Al2O3/SiO2/TiO2) on mechanical performance of epoxy/glass fiber hybrid composites
RK Nayak, A Dash, BC Ray - Procedia materials science, 2014 - Elsevier
Fiber reinforced polymer composite is an important material for structural application. The
diversified application of FRP composite has taken centre of attraction for interdisciplinary …
diversified application of FRP composite has taken centre of attraction for interdisciplinary …
High-performance epoxy/silica coated silver nanowire composites as underfill material for electronic packaging
Silver nanowires (AgNWs), as one-dimensional nanostructured materials, possess high
aspect ratio and intrinsically high thermal conductivity. However, AgNWs are difficult to …
aspect ratio and intrinsically high thermal conductivity. However, AgNWs are difficult to …
Remarkable enhancement of thermal stability of epoxy resin through the incorporation of mesoporous silica micro-filler
For the first time, we incorporated mesoporous micro-silica (5 μm, pore size= 50 nm) as a
filler in epoxy resin aiming to enter polymer into the pore of the silica. As expected, the …
filler in epoxy resin aiming to enter polymer into the pore of the silica. As expected, the …
UV-curable, low-viscosity resin with a high silica filler content for preparing ultrastiff, 3D-printed molds
Z Yang, S Peng, Z Wang, JT Miao… - ACS Applied Polymer …, 2022 - ACS Publications
Mold forming is among the most valuable methods of plastic processing and engineering
due to its high accuracy and efficient throughput. However, complex processes are needed …
due to its high accuracy and efficient throughput. However, complex processes are needed …
In response to a complaint we received under the US Digital Millennium Copyright Act, we have removed 1 result(s) from this page. If you wish, you may read the DMCA complaint that caused the removal(s) at LumenDatabase.org.