Near-junction thermal managements of electronics

YC Hua, Y Shen, ZL Tang, DS Tang, X Ran… - Advances in Heat …, 2023 - Elsevier
Near-junction thermal management of electronics has received a lot of attention in the past
decades but there are still many challenges in this area. This chapter provides a …

Controlling surface/interface states in GaN-based transistors: Surface model, insulated gate, and surface passivation

JT Asubar, Z Yatabe, D Gregusova… - Journal of Applied …, 2021 - pubs.aip.org
Controlling surface/interface states in GaN-based transistors: Surface model, insulated gate,
and surface passivation | Journal of Applied Physics | AIP Publishing Skip to Main Content …

Near-junction phonon thermal spreading in GaN HEMTs: A comparative study of simulation techniques by full-band phonon Monte Carlo method

Y Shen, HA Yang, BY Cao - International Journal of Heat and Mass …, 2023 - Elsevier
Accurate thermal simulation is essential for the near-junction thermal management and
electro-thermal co-design of GaN HEMTs. While various methods have been employed to …

Bias dependence of non-Fourier heat spreading in GaN HEMTs

Y Shen, XS Chen, YC Hua, HL Li… - IEEE Transactions on …, 2022 - ieeexplore.ieee.org
In this article, self-heating in gallium nitride (GaN) high-electron-mobility transistors (HEMTs)
is studied by combining the technology computer-aided design (TCAD) and phonon Monte …

[HTML][HTML] Thermal conductivity of ScxAl1− xN and YxAl1− xN alloys

DQ Tran, F Tasnádi, A Žukauskaitė, J Birch… - Applied Physics …, 2023 - pubs.aip.org
Owing to their very large piezoelectric coefficients and spontaneous polarizations,(Sc, Y) x
Al 1− x N alloys have emerged as a new class of III-nitride semiconductor materials with …

Spectral thermal spreading resistance of wide-bandgap semiconductors in ballistic-diffusive regime

Y Shen, YC Hua, HL Li, SL Sobolev… - IEEE Transactions on …, 2022 - ieeexplore.ieee.org
To develop efficient thermal management strategies for wide-bandgap (WBG)
semiconductor devices, it is essential to have a clear understanding of the heat transport …

Thermal analysis of GaN HEMTs using nongray multi-speed phonon lattice Boltzmann method under Joule heating effect

X Rao, Y Wu, K Huang, H Zhang, C **ao - Microelectronics Journal, 2024 - Elsevier
Abstract Gallium Nitride (GaN) high electron mobility transistors (HEMTs) exhibit superior
electrical properties for power and radio frequency applications, but performance is …

Thermal conductivity of epitaxial layers

DQ Tran, RD Carrascon, M Iwaya, B Monemar… - Physical Review …, 2022 - APS
Al x Ga 1− x N ternary alloys are emerging ultrawide band gap semiconductor materials for
high-power electronics applications. The heat dissipation, which mainly depends on the …

On-Chip Integrated High-Sensitivity Temperature Sensor Based on p-GaN/AlGaN/GaN Heterostructure

J Chang, Y Yin, J Du, H Wang, H Li… - IEEE Electron …, 2023 - ieeexplore.ieee.org
An on-chip integrated temperature sensor based on a-GaN/AlGaN/GaN heterostructure is
demonstrated. The sensor consists of a two-dimensional-electron-gas (2DEG) resistor and a …

High-temperature HEMT model

N Sahebghalam, M Shalchian… - … on Electron Devices, 2022 - ieeexplore.ieee.org
Taking into account the impact of self-heating and temperature rise effects, this work
presents a physics-based analytical model for HEMTs, operating continuously from room …