An electronic device may be provided with wireless circuitry. The wireless circuitry may
include one or more antennas and transceiver circuitry such as millimeter wave transceiver …

An antenna is described on ceramics that may be used for a packaged die. In one example,
a package has a die, a ceramic substrate over the die, an antenna attached to the ceramic …

The present disclosure relates to a Gallium-Nitride (GaN) based module, which includes a
module substrate, a thinned switch die residing over the module substrate, a first mold …

An antenna module includes a connection member including at least one wiring layer and at
least one insulating layer; an integrated circuit (IC) package disposed on a first surface of the …

An electronic device may be provided with wireless circuitry. The wireless circuitry may
include one or more antennas and transceiver circuitry such as millimeter wave transceiver …

An electronic device may be provided with wireless cir cuitry that includes antenna
structures used to determine the position and orientation of the electronic device relative to …

A phased-array antenna includes an antenna layer of a stacked printed circuit board, a
ground plane layer of the stacked printed circuit board spaced apart from the antenna layer …

An electronic device is provided. The electronic device may comprise a housing comprising:
a front plate facing a first direction, a back plate facing a second direction opposite to the first …

A system-in-package includes a package substrate that at least partially surrounds an
embedded radio-frequency inte grated circuit chip and a processor chip mated to a redistri …

A microwave antenna apparatus comprises a semiconductor package module comprising a
mold layer, a semiconductor element, a coupling element and a redistribution layer, and an …