A high density interconnect arrangement takes the form of a backplane-pluggable card, with
electrical connections formed along a single (pluggable) edge and all remaining …

A system includes a housing and a first circuit board positioned inside the housing. The
housing has a top panel, a bottom panel, a left side panel, a right side panel, a front panel …

A semiconductor structure can include an active device FET region having a FET and a
photonics region having a photonic device including a waveguide. A semiconductor …

A system accesses a set of devices transferring a data element from a source device to a
destination device. The system determines a transformation type implemented on the data …

The present invention provides an integrated system-on-chip device. The device is
configured on a single silicon substrate member. The device has a data input/output …

An optical interconnect device on a silicon substrate is disclosed which includes a trench
having two slanted side walls opposite to each other, a number of polymer wave guides …

A system includes a housing including a front panel, a rear panel, an upper panel, and a
lower panel. The system includes a first circuit board or substrate, at least one data …

Described herein is an integrated photonics device including a light emitter, integrated edge
outcoupler (s), optics, and a detector array. The device can include a hermetically sealed …

A laser chip including a plurality of stripes is disclosed, where a laser stripe can be grown
with an initial optical gain profile, and its optical gain profile can be shifted by using an …

A hybrid laser structure (comprising III-V gain material and a silicon-based photonic
integrated circuit) is configured to control the number of generated mode-locked …