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Ultrafine‐Grained Titanium‐Based Alloys: Structure and Service Properties for Engineering Applications
IP Semenova, VV Polyakova… - Advanced …, 2020 - Wiley Online Library
Herein, an overview of the recent research on the relationship between the ultrafine‐grained
(UFG) structure of titanium and its alloys and the physical and mechanical properties of the …
(UFG) structure of titanium and its alloys and the physical and mechanical properties of the …
Tracer diffusion in single crystalline CoCrFeNi and CoCrFeMnNi high-entropy alloys: Kinetic hints towards a low-temperature phase instability of the solid-solution?
D Gaertner, J Kottke, Y Chumlyakov, F Hergemöller… - Scripta Materialia, 2020 - Elsevier
Tracer-diffusion of constituting elements in single-crystalline CoCrFeNi and CoCrFeMnNi is
measured from 923 K to 1373 K. In CoCrFeMnNi, low-temperature deviations from otherwise …
measured from 923 K to 1373 K. In CoCrFeMnNi, low-temperature deviations from otherwise …
Atomic-scale investigation of electromigration with different directions of electron flow into high-density nanotwinned copper through in situ HRTEM
FC Shen, CY Huang, HY Lo, WY Hsu, CH Wang… - Acta Materialia, 2021 - Elsevier
Electromigration (EM) has aroused substantial attention with the shrinkage of modern
devices. EM is an interaction between electron carriers and atoms, meaning that it arises …
devices. EM is an interaction between electron carriers and atoms, meaning that it arises …
Microstructural evolution and growth behavior of intermetallic compounds at the liquid Al/solid Fe interface by synchrotron X-ray radiography
Abstract The growth of Inter-Metallic Compounds (IMCs) with dissolution was investigated
on the liquid Al/solid Fe interconnection by using synchrotron radiation real-time imaging …
on the liquid Al/solid Fe interconnection by using synchrotron radiation real-time imaging …
Growth kinetics of Cu6Sn5 intermetallic compound in Cu-liquid Sn interfacial reaction enhanced by electric current
In this paper, electric currents with the densities of 1.0× 102 A/cm2 and 2.0× 102 A/cm2 were
imposed to the Cu-liquid Sn interfacial reaction at 260° C and 300° C with the bonding times …
imposed to the Cu-liquid Sn interfacial reaction at 260° C and 300° C with the bonding times …
Integration of machine learning with phase field method to model the electromigration induced Cu6Sn5 IMC growth at anode side Cu/Sn interface
Currently, in the era of big data and 5G communication technology, electromigration has
become a serious reliability issue for the miniaturized solder joints used in microelectronic …
become a serious reliability issue for the miniaturized solder joints used in microelectronic …
Extremely fast formation of CuSn intermetallic compounds in Cu/Sn/Cu system via a micro-resistance spot welding process
High-temperature-stable circuit interconnects are highly desirable for the wide band-gap
semiconductor devices to operate in harsh environment (> 200° C). In this study, a full Cu 3 …
semiconductor devices to operate in harsh environment (> 200° C). In this study, a full Cu 3 …
Effect of electric current on grain orientation and mechanical properties of Cu-Sn intermetallic compounds joints
Electric current-assisted bonding experiments have been performed on Cu/Sn/Cu joints
using an electric current density of 2.0× 10 2 A/cm 2 at 260° C. The effect of electric current …
using an electric current density of 2.0× 10 2 A/cm 2 at 260° C. The effect of electric current …
In situ observation on the formation of intermetallics compounds at the interface of liquid Al/solid Ni
The growth of intermetallic compounds (IMCs) in liquid Al were observed on Ni substrate
through synchrotron radiation real-time imaging technology. The results provided direct …
through synchrotron radiation real-time imaging technology. The results provided direct …
Ultrafast formation of unidirectional and reliable Cu3Sn-based intermetallic joints assisted by electric current
Abstract High-temperature-stable Cu 3 Sn-based joints were selectively fabricated using
electric current-assisted bonding process within an extremely short time (∼ 200 ms) and …
electric current-assisted bonding process within an extremely short time (∼ 200 ms) and …