Nanostructured materials contain an extremely high density of interfaces. The properties of
these materials when exposed to extreme conditions of radiation dose, stress, deformation …

The development of big data and artificial intelligence technology is increasing the need for
electronic devices to become smaller, cheaper, and more energy efficient, while also having …

Enhancing both strength and ductility simultaneously in commercial alloys at an industrial
scale remains a challenging task. In this study, we have demonstrated a simple heat …

TiAl alloys are lightweight, show decent corrosion resistance and have good mechanical
properties at elevated temperatures, making them appealing for high-temperature …

The electrochemical carbon dioxide reduction reaction (CO2RR) is a promising route to
close the carbon cycle by reducing CO2 into valuable fuels and chemicals. Electrocatalysts …

Quasi-in-situ method was carried out to observe the growth behavior of intermetallic
compounds (IMCs) in Cu/Sn-3.0 Ag-0.5 Cu/Cu micro solder joints with single β-Sn grain …

As one of the promising packaging materials, the paste of silver nanoparticles (AgNPs)
reinforced by SiC particles is investigated in this study for microstructure, thermal stability …

Coherent twin boundaries (CTBs) are widely described, both theoretically and
experimentally, as perfect interfaces that play a significant role in a variety of materials …

Twinning is demonstrated to be an effective way of enhancing efficiencies of metallic
catalysts toward electrolytic water splitting. Dendritic Cu possessing dense coherent …

Abstract Direct Cu-to-Cu bonding was achieved at temperatures of 150–250° C using a
compressive stress of 100 psi (0.69 MPa) held for 10–60 min at 10− 3 torr. The key …