Laser processing with ultra-short double pulses has gained attraction since the beginning of
the 2000s. In the last decade, pulse bursts consisting of multiple pulses with a delay of …

Laser direct writing is a widely employed technique for 3D, contactless, and fast
functionalization of dielectrics. Its success mainly originates from the utilization of ultrashort …

Over the last decade, lasers have been gradually employed for Si wafer dicing to replace
blade dicing. Laser dicing has the potential to replace blade dicing as the future generation …

Laser micro‐welding is an advanced manufacturing method today applied in various
domains. However, important physical limitations have prevented so far to demonstrate its …

The advent of ultrafast infrared lasers provides a unique opportunity for direct fabrication of
three-dimensional silicon microdevices. However, strong nonlinearities prevent access to …