The state of the art of lead-free solder joint reliability is investigated in this study. Emphasis is
placed on the design for reliability (DFR) and reliability testing and data analysis. For …

This book focuses on the assembly and reliability of lead-free solder joints. Both the
principles and engineering practice are addressed, with more weight placed on the latter …

In the electronic packaging industry, it is important to be able to make accurate predictions of
board level solder joint reliability during thermal cycling exposures. The Anand viscoplastic …

The microstructure, mechanical response, and failure behavior of lead free solder joints in
electronic assemblies are constantly evolving when exposed to isothermal aging and/or …

The reliability of an electronic product highly attributes to the fatigue failure of an
interconnected solder joint. The normal operating temperature for many electronic …

Due to the global trend of green manufacturing, lead-free becomes the main stream
soldering choice of electronic industry. SnAgCu alloys are the prevailing choices, with SnCu …

For SnAgCu alloys, the results of previous studies suggest that high-temperature thermal
ageing causes quick and significant deterioration of their mechanical properties. However …

The impact of assembly stiffness and solder properties on thermal cycle acceleration factors
was investigated using a simplified model of an electronic assembly. It was seen that stress …

During the past decade the demand for high performance automotive electronics is steadily
increasing. An efficient development of such products requires the use of durability …

The paper presents creep data, that was gained on non eutectic SnAgCu-solder specimens
with a variety of compositions. The non eutectic SnAgCu-alloys were tested in different …