Thermal management has been considered as a key issue for high-power electronics.
Thermal interface materials (TIMs) play an extremely important role in the field of thermal …

The demand for thermal management tools has triggered the fast development of materials
that efficiently manipulate thermal energy. Pristine polymers and their composites have been …

Modern highly integrated microelectronic devices are unable to dissipate heat over time,
which greatly affects the operating efficiency and service life of electronic equipment …

High alignment of graphene in mesophase pitch-based carbon fibers endows them with
excellent properties such as high thermal conductivity and ultrahigh modulus. However, the …

This paper significantly improved the transverse thermal conductivity (TC) of unidirectional
carbon fiber reinforced polymer (CFRP) laminates by a simple and effective method of …

Ultralow interfacial adhesion of pitch-based carbon fiber composites has always a disturbing
problem in reality since the fiber surface is of high graphite degree. Herein, a novel strategy …

Polymer-based thermal interface materials (TIMs) are indispensable for reducing the thermal
contact resistance of high-power electronic devices. Owing to the low thermal conductivity of …

Several kinds of inorganic nanofillers especially boron nitride (BN) are introduced to
improve the thermal conducting properties of epoxy resin (EP). In this work, the influence of …

With the rapid development of electronic devices and digital communication, the problem of
overheating emerges due to high integration, high power and high frequency. At present, it …

To enhance the mechanical, thermal, and electrical properties and economic profits,
polycarbonates (PCs) have been blended with various inorganic additives for the past few …