Ridge gap waveguide (RGW) technology is used in the design of a frequency scanning
antenna with high gain and directivity. A Quasi-TEM horn with shaped ridge is designed as a …

This article presents a packaging technique for monolithic microwave integrated circuits
(MMIC) demonstrated in a fully integrated receiver (Rx) module at the D-band (110-170 …

We present the design of a new ultra-wideband (UWB) 3 dB power divider, packaged by
using Gap Waveguide Technology. The power divider, a simple compact T-junction …

We investigate the application of perfect magnetic conductor (PMC) packaging for a
nonsmooth perfect electric conductor surface, caused by metalized via holes. The PMC …

This paper presents a D-band interconnect realized using unilateral finline structure. The
interconnect consists of a microstrip line implemented on a 75μm-thick SiC substrate. The …

In this work, periodic structure has been used to design a new type of packaging technique
to improve the isolation between microwave components within a module. In contrast to the …

In this work, an on-chip Monolithic Microwave Integrated Circuit (MMIC) to waveguide
transition is realized based on Linearly Tapered Slot antenna (LTSA) structure. The antenna …

Abstract Low Temperature Co-fired Ceramic (LTCC) is a proven packaging technology for
microwave and millimetre-wave applications. Advanced low-loss material systems and …

As the communication system goes up to millimeter-wave frequencies for high data rate
demands, the conventional microstrip line no longer meets the requirements due to its …

Abstract Recently, Terahertz (THz) systems have witnessed increasing attention due to the
continuous need for high data rate transmission which is mainly driven by next-generation …