A review on laser drilling and cutting of silicon
HJ Wang, T Yang - Journal of the European Ceramic Society, 2021 - Elsevier
Silicon is the most widely used material in numerous fields. Traditional mechanical
machining methods have been unable to meet the higher requirements of processing …
machining methods have been unable to meet the higher requirements of processing …
Laser machining of transparent brittle materials: from machining strategies to applications
X **, debris, large
kerf widths, tapering and high surface roughness or nonuniform surfaces. Laser beam …
kerf widths, tapering and high surface roughness or nonuniform surfaces. Laser beam …
Topological transition from deeply sub-to near-wavelength ripples during multi-shot mid-IR femtosecond laser exposure of a silicon surface
Multi-shot exposure of silicon surface in air by mid-infrared (MIR, 2.5–5 microns)
femtosecond laser pulses results in an initial (N_p= 2–5 shots) appearance of a bright spot …
femtosecond laser pulses results in an initial (N_p= 2–5 shots) appearance of a bright spot …