Transient liquid phase (TLP) bonding is a novel bonding process for the joining of metallic
and ceramic materials using an interlayer. TLP bonding is particularly crucial for the joining …

To meet the increasing requirement of high-temperature die attach for power module on the
excellent thermal conductivity and reliability, a novel Ag paste modified with AlN …

With the growing joining requirements of emergent engineering materials and new
applications, conventional welding continues to evolve at all scales spanning from the …

In this study, an effective transient liquid phase (TLP) bonding structure using a composite
solder preform including a Cu metal foam was formed. Cu foam has a large surface area …

Abstract Silver (Ag) and indium (In) are increasingly investigated as transient liquid phase
(TLP) bonding materials for die attachment in next generation power modules. In this study …

With the development of high-integration and high-power electronics, the lack of matching
chip connecting materials that can withstand high temperatures has been a challenge. In …

Most micro-electro-mechanical systems (MEMS) devices contain fragile moving parts, which
poses challenges in process integration of interconnection methods requiring wet-chemistry …

Herein, the favorable influence of sandwich‐stacked Sn/SAC305/Sn multilayers on the
micromechanical and electrical properties of the Cu‐Sn/SAC305/Sn‐Cu solder joints over …

Two different types of lead‐free solder joints Cu/(Sn3. 0Ag0. 5Cu)/Cu and Cu/Sn/(Sn3.
0Ag0. 5Cu)/Sn/Cu have been investigated. Joints are produced following the transient liquid …

This study introduces research trends in the electronics materials, such as joining materials
including high-temperature lead-free solder, sintered materials using metal particles and …