The characterization of chemical reactions at the buried interface is critical to understand
interfacial molecular interactions and improve interfacial properties like adhesion. Interface …

In this study, the influence of an amino silane (3-(2-aminoethylamino)-
propyldimethoxymethylsilane, AEAPS) on the interfacial structure and adhesion of butyl …

Maleic anhydride (MAH)-modified polymers are used as tie layers for binding dissimilar
polymers in multilayer polymer films. The MAH chemistry which promotes adhesion is well …

Separating adhesives from substrates is important for recycling metals and polymer
materials used in a variety of applications such as food packaging and electronics. A proof …

This study investigates the chemistry and performance of two commercial no-clean fluxes
(NCFs) ii. e., NC-1 and NC-2. One water-soluble (WS) flux was also studied for comparison …

Background With the development of three-dimensional (3D) integration technology
including extreme ultraviolet (EUV) lithography, more and more buried interfaces are …

Purpose This paper aims to present new analytical model for the filling times prediction in
flip-chip underfill encapsulation process that is based on the surface energetic for post-bump …

The miniaturisation, ultra-thinness and high-density multi-layer structure of advanced
microelectronic packages complicate the propagation mechanism of ultrasonic waves. In …

2.5 D heterogeneous integrated packaging required better adhesive performance of
underfill at high temperature. This study found that: a) underfill with a higher glass transition …

The complexity of cleaning caused by miniaturization of electronic packages and the drive
towards cost reduction have recently led to the development of no-clean fluxes (NCF). In this …