Enhancing ball grid array (BGA) component design and reliability using a novel reliability-based design optimization (RBDO) methodology

S Ghenam, A El Hami, K Dammak, W Gafsi… - Mechanics of …, 2024 - Taylor & Francis
In industry and research areas, the importance of reliable and optimally designed BGA
components has remarkably grown. To tackle this challenge, we elaborated an innovative …

Optimal performance and cost-effective design of BGA solder joints using a deterministic design optimization (DDO) under real operating conditions

S Ghenam, A El Hami, W Gafsi, A Akrout… - Microelectronics …, 2023 - Elsevier
Users of electronic devices expect efficiency, affordability, and long service life. From this
perspective, the optimization of their performance while reducing costs is paramount. The …

A proposed multiphysics comparison of different alloy compositions for electro-thermomechanical reliability analysis

S Ghenam, AE Hami, W Gafsi, A Akrout, M Haddar - Welding in the World, 2024 - Springer
Given the tremendous growth of the microelectronics industry in recent years, soldering
efficiency is more crucial than ever. Despite the great importance of the solder joints, these …

Creep response of various solders used in soldering ball grid array (BGA) on printed circuit board (PCB)

JA Depiver, S Mallik, EH Amalu - International Journal of …, 2019 - repository.derby.ac.uk
In electronics packaging, solder joints play a critical role by providing electrical, thermal and
mechanical connections between the package and the printed circuit board (PCB). As the …

Creep damage of BGA solder interconnects subjected to thermal cycling and isothermal ageing

JA Depiver, S Mallik, D Harmanto… - 2019 IEEE 21st …, 2019 - ieeexplore.ieee.org
Solder joints of electronic components are the most critical part of any electronic device.
Their untimely failure during the system's operation often culminates in catastrophic failure of …

Comparative study of lead-free alloys submitted to thermomechanical ageing

H Friaa, A Guédon-Gracia, H Frémont… - … and Multi-Physics …, 2024 - ieeexplore.ieee.org
Following the European RoHS directive's restriction of certain dangerous substances,
including lead in a range of electronic and electrical equipment, the SnPb eutectic, which …

Durability distribution analysis of lead-free solder joints for printed circuit board applications

CM Huang - 2023 - search.proquest.com
Fatigue models for predicting the cycles to failure of solder joints under temperature cycling
situations have been discussed and developed for decades. However, most models were …

[BOG][B] Thermo-mechanical reliability studies of lead-free solder interconnects

JA Depiver - 2021 - search.proquest.com
Solder interconnections, also known as solder joints, are the weakest link in electronics
packaging. Reliability of these miniature joints is of utmost interest-especially in safety …

Fiabilité des systèmes électroniques multiphysiques en environnement critique: application à l'optimisation des composants BGA

S Ghenam - 2023 - theses.hal.science
L'électronique occupe une place prépondérante dans notre société moderne, jouant un rôle
essentiel dans les domaines des communications, de l'informatique et de l'industrie. La …

Analysis of LED Solder Joints During Combined Power and Thermal Cycling

K Maarouf, C Roucoules, H KlÖcker… - 2024 IEEE 10th …, 2024 - ieeexplore.ieee.org
VLS's lighting products offer enhanced brightness along with intelligent features and
sustainable solutions to decrease CO2 emissions. These new features ensure an optimal …