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Enhancing ball grid array (BGA) component design and reliability using a novel reliability-based design optimization (RBDO) methodology
In industry and research areas, the importance of reliable and optimally designed BGA
components has remarkably grown. To tackle this challenge, we elaborated an innovative …
components has remarkably grown. To tackle this challenge, we elaborated an innovative …
Optimal performance and cost-effective design of BGA solder joints using a deterministic design optimization (DDO) under real operating conditions
Users of electronic devices expect efficiency, affordability, and long service life. From this
perspective, the optimization of their performance while reducing costs is paramount. The …
perspective, the optimization of their performance while reducing costs is paramount. The …
A proposed multiphysics comparison of different alloy compositions for electro-thermomechanical reliability analysis
Given the tremendous growth of the microelectronics industry in recent years, soldering
efficiency is more crucial than ever. Despite the great importance of the solder joints, these …
efficiency is more crucial than ever. Despite the great importance of the solder joints, these …
Creep response of various solders used in soldering ball grid array (BGA) on printed circuit board (PCB)
In electronics packaging, solder joints play a critical role by providing electrical, thermal and
mechanical connections between the package and the printed circuit board (PCB). As the …
mechanical connections between the package and the printed circuit board (PCB). As the …
Creep damage of BGA solder interconnects subjected to thermal cycling and isothermal ageing
Solder joints of electronic components are the most critical part of any electronic device.
Their untimely failure during the system's operation often culminates in catastrophic failure of …
Their untimely failure during the system's operation often culminates in catastrophic failure of …
Comparative study of lead-free alloys submitted to thermomechanical ageing
H Friaa, A Guédon-Gracia, H Frémont… - … and Multi-Physics …, 2024 - ieeexplore.ieee.org
Following the European RoHS directive's restriction of certain dangerous substances,
including lead in a range of electronic and electrical equipment, the SnPb eutectic, which …
including lead in a range of electronic and electrical equipment, the SnPb eutectic, which …
Durability distribution analysis of lead-free solder joints for printed circuit board applications
CM Huang - 2023 - search.proquest.com
Fatigue models for predicting the cycles to failure of solder joints under temperature cycling
situations have been discussed and developed for decades. However, most models were …
situations have been discussed and developed for decades. However, most models were …
[BOG][B] Thermo-mechanical reliability studies of lead-free solder interconnects
JA Depiver - 2021 - search.proquest.com
Solder interconnections, also known as solder joints, are the weakest link in electronics
packaging. Reliability of these miniature joints is of utmost interest-especially in safety …
packaging. Reliability of these miniature joints is of utmost interest-especially in safety …
Fiabilité des systèmes électroniques multiphysiques en environnement critique: application à l'optimisation des composants BGA
S Ghenam - 2023 - theses.hal.science
L'électronique occupe une place prépondérante dans notre société moderne, jouant un rôle
essentiel dans les domaines des communications, de l'informatique et de l'industrie. La …
essentiel dans les domaines des communications, de l'informatique et de l'industrie. La …
Analysis of LED Solder Joints During Combined Power and Thermal Cycling
K Maarouf, C Roucoules, H KlÖcker… - 2024 IEEE 10th …, 2024 - ieeexplore.ieee.org
VLS's lighting products offer enhanced brightness along with intelligent features and
sustainable solutions to decrease CO2 emissions. These new features ensure an optimal …
sustainable solutions to decrease CO2 emissions. These new features ensure an optimal …