Scanning thermal microscopy

A Majumdar - Annual review of materials science, 1999 - annualreviews.org
▪ Abstract This chapter presents a review of the technology of scanning thermal microscopy
(SThM) and its applications in thermally probing micro-and nanostructured materials and …

Thermography techniques for integrated circuits and semiconductor devices

W Liu, B Yang - Sensor Review, 2007 - emerald.com
Purpose–The goal of this review paper is to provide information on several commonly used
thermography techniques in semiconductor and micro‐device industry and research today …

[HTML][HTML] Characterization of the temperature dependence of the thermoreflectance coefficient for conductive thin films

T Favaloro, JH Bahk, A Shakouri - Review of Scientific Instruments, 2015 - pubs.aip.org
We describe a novel approach for calibration of the thermoreflectance coefficient, ideally
suited for measurements in a vacuum thermostat, and present the high temperature …

Quantitative thermal imaging by synchronous thermoreflectance with optimized illumination wavelengths

G Tessier, S Hole, D Fournier - Applied Physics Letters, 2001 - pubs.aip.org
Using thermoreflectance microscopy with a camera, we have designed a system which
delivers submicronic images of the alternative temperature variations in integrated circuits …

Calibration procedure for temperature measurements by thermoreflectance under high magnification conditions

S Dilhaire, S Grauby, W Claeys - Applied Physics Letters, 2004 - pubs.aip.org
We show that, in thermoreflectance measurements under high focusing conditions, the
signal is not only due to the surface temperature variations. Indeed, the reflected light from …

Noncontact transient temperature map** of active electronic devices using the thermoreflectance method

MG Burzo, PL Komarov, PE Raad - IEEE transactions on …, 2005 - ieeexplore.ieee.org
This work presents a demonstration of the applicability and efficacy of an experimental
system capable of noninvasively and nondestructively scanning the transient surface …

Dynamic surface temperature measurements in ICs

J Altet, W Claeys, S Dilhaire… - Proceedings of the IEEE, 2006 - ieeexplore.ieee.org
Measuring techniques of the die surface temperature in integrated circuits are reported as
very appropriate for failure analysis, for thermal characterization, and for testing modern …

Optical measurement of thermal contact conductance between wafer-like thin solid samples

Y Ohsone, G Wu, J Dryden, F Zok, A Majumdar - 1999 - asmedigitalcollection.asme.org
This paper presents a noncontact optical technique for measuring the thermal contact
conductance between wafer-like thin solid samples. The technique is based on heating one …

Thermal coupling in integrated circuits: application to thermal testing

J Altet, A Rubio, E Schaub, S Dilhaire… - IEEE Journal of Solid …, 2002 - ieeexplore.ieee.org
The power dissipated by the devices of a circuit can be construed as a signature of the
circuit's performance and state. Without disturbing the circuit operation, this power …

Perspective on non-invasive and non-destructive photoacoustic and photothermal applications

C Glorieux - Journal of Applied Physics, 2022 - pubs.aip.org
This contribution intends to convince readers that by virtue of the rich physics involved,
optical excitation, thermal diffusion, thermal expansion, and acoustic wave propagation, and …