Application of ZnO nanoparticles in Sn99Ag0. 3Cu0. 7-based composite solder alloys
The properties of Sn99Ag0. 3Cu0. 7 (SACX0307) solder alloy reinforced with ZnO
nanoparticles were investigated. The primary ZnO particle sizes were 50, 100, and 200 nm …
nanoparticles were investigated. The primary ZnO particle sizes were 50, 100, and 200 nm …
The influence of soldering profile on the thermal parameters of insulated gate bipolar transistors (IGBTs)
The effect of solder joint fabrication on the thermal properties of IGBTs soldered onto glass-
epoxy substrate (FR4) was investigated. Glass-epoxy substrates with a thickness of 1.50 …
epoxy substrate (FR4) was investigated. Glass-epoxy substrates with a thickness of 1.50 …
Thermal enhancement of optical-thermal-electrical isolation package structure for UVA LEDs
As one of the most important heat transfer channels for ultraviolet radiation-A light-emitting
diodes (UVA LEDs), the substrate often simultaneously undertakes the tasks of electrical …
diodes (UVA LEDs), the substrate often simultaneously undertakes the tasks of electrical …
Comparison of properties for selected experimental set-ups dedicated to measuring thermal parameters of power LEDs
This article compares properties of two measurement set-ups dedicated to determining
thermal parameters of power LEDs. The standard T3Ster set-up and the custom set-up …
thermal parameters of power LEDs. The standard T3Ster set-up and the custom set-up …
Low-Temperature and High-Speed Pressure-Assisted Sinter Bonding Using Ag Derived by the Redox Reaction of Ethylene Glycol-Based Ag2O Paste
YJ Lee, JH Lee - Electronic Materials Letters, 2022 - Springer
To accomplish a high-speed bonding process of dies for the formation of a bondline with
mechanical reliability at high temperatures and excellent thermal conductance, pressure …
mechanical reliability at high temperatures and excellent thermal conductance, pressure …
Investigations of an influence of the assembling method of the die to the case on thermal parameters of IGBTs
This article presents the results of investigations illustrating the influence of the method of
assembling the die of the insulated gate bipolar transistor (IGBT) to the base of the TO-220 …
assembling the die of the insulated gate bipolar transistor (IGBT) to the base of the TO-220 …
Influence of the soldering paste type on optical and thermal parameters of LED modules
Purpose This paper presents the results of the investigations of LED modules soldered with
the use of different soldering pastes. Design/methodology/approach The tested power LED …
the use of different soldering pastes. Design/methodology/approach The tested power LED …
[PDF][PDF] 电子封装用低银 Sn-0.3 Ag-0.7 Cu 钎料研究进展
孔祥霞， 翟军军， 孙凤莲 - 机械工程学报, 2022 - qikan.cmes.org
随着电子封装无铅化, 高集成度需求的不断提升, 开发低成本, 高性能的无铅封装材料对传统含铅
材料进行有效替代已成为全球关注的热点. 目前所开发的Sn-Ag-Cu 系无铅钎料中含银量最低的 …
材料进行有效替代已成为全球关注的热点. 目前所开发的Sn-Ag-Cu 系无铅钎料中含银量最低的 …
[PDF][PDF] Research Progress of Low-Silver Sn-0.3 Ag-0.7 Cu Solder for Electronic Packaging
孔祥霞， 翟军军， 孙凤莲 - Journal of Mechanical Engineering - qikan.cmes.org
With the increasing demand for lead-free and high integration of electronic packaging, the
development of low-cost and high-performance lead-free packaging materials to effectively …
development of low-cost and high-performance lead-free packaging materials to effectively …
[PDF][PDF] Comparison of Properties for Selected Experimental Set-Ups Dedicated to Measuring Thermal Parameters of Power LEDs. Energies 2021, 14, 3240
This article compares properties of two measurement set-ups dedicated to determining
thermal parameters of power LEDs. The standard T3Ster set-up and the custom set-up …
thermal parameters of power LEDs. The standard T3Ster set-up and the custom set-up …