The future transistors

W Cao, H Bu, M Vinet, M Cao, S Takagi, S Hwang… - Nature, 2023 - nature.com
The metal–oxide–semiconductor field-effect transistor (MOSFET), a core element of
complementary metal–oxide–semiconductor (CMOS) technology, represents one of the …

Considerations for ultimate CMOS scaling

KJ Kuhn - IEEE transactions on Electron Devices, 2012 - ieeexplore.ieee.org
This review paper explores considerations for ultimate CMOS transistor scaling. Transistor
architectures such as extremely thin silicon-on-insulator and FinFET (and related …

[HTML][HTML] ASAP7: A 7-nm finFET predictive process design kit

LT Clark, V Vashishtha, L Shifren, A Gujja, S Sinha… - Microelectronics …, 2016 - Elsevier
We describe a 7-nm predictive process design kit (PDK) called the ASAP7 PDK, developed
in collaboration with ARM Ltd. for academic use. The PDK is realistic, based on current …

Process technology variation

KJ Kuhn, MD Giles, D Becher, P Kolar… - … on Electron Devices, 2011 - ieeexplore.ieee.org
Moore's law technology scaling has improved performance by five orders of magnitude in
the last four decades. As advanced technologies continue the pursuit of Moore's law, a …

Scaling challenges for advanced CMOS devices

AP Jacob, R **e, MG Sung, L Liebmann… - … Journal of High …, 2017 - World Scientific
The economic health of the semiconductor industry requires substantial scaling of chip
power, performance, and area with every new technology node that is ramped into …

Cell circuit and layout with linear finfet structures

ST Becker - US Patent 9,563,733, 2017 - Google Patents
(57) ABSTRACT A cell circuit and corresponding layout is disclosed to include linear-
shaped diffusion fins defined to extend over a Substrate in a first direction so as to extend …

Power-gated 9T SRAM cell for low-energy operation

TW Oh, H Jeong, K Kang, J Park… - IEEE Transactions on …, 2016 - ieeexplore.ieee.org
This brief proposes a novel power-gated 9T (PG9T) static random access memory (SRAM)
cell that uses a read-decoupled access buffer and power-gating transistors to execute …

Electro-thermal performance boosting in stacked Si gate-all-around nanosheet FET with engineered source/drain contacts

S Venkateswarlu, O Badami… - IEEE Transactions on …, 2021 - ieeexplore.ieee.org
In this article, we investigate the electro-thermal (ET) performance of stacked Si gate-all-
around (GAA) nanosheet FET (NSHFET) by adopting the metal (M0) source/drain (S/D) …

Total-Ionizing-Dose Effects and Low-Frequency Noise in 30-nm Gate-Length Bulk and SOI FinFETs With SiO2/HfO2 Gate Dielectrics

M Gorchichko, Y Cao, EX Zhang, D Yan… - … on Nuclear Science, 2019 - ieeexplore.ieee.org
Total-ionizing-dose (TID) effects and low-frequency noise are evaluated in 30-nm gate-
length bulk and silicon-on-insulator (SOI) FinFETs for devices with fin widths of 10-40 nm …

Graphene nanoribbon field-effect transistors on wafer-scale epitaxial graphene on SiC substrates

WS Hwang, P Zhao, K Tahy, LO Nyakiti, VD Wheeler… - APL materials, 2015 - pubs.aip.org
We report the realization of top-gated graphene nanoribbon field effect transistors
(GNRFETs) of∼ 10 nm width on large-area epitaxial graphene exhibiting the opening of a …