Modeling of wide-bandgap power semiconductor devices—Part II

E Santi, K Peng, HA Mantooth… - IEEE Transactions on …, 2014 - ieeexplore.ieee.org
Compact models of wide-bandgap power devices are necessary to analyze and evaluate
their impact on circuit and system performance. Part I reviewed compact models for silicon …

Nonsegmented PSpice circuit model of GaN HEMT with simulation convergence consideration

H Li, X Zhao, W Su, K Sun, X You… - IEEE Transactions on …, 2017 - ieeexplore.ieee.org
To solve the simulation convergence problem of enhancement mode gallium nitride high-
electron mobility transistor (GaN HEMT) models, this paper proposes a nonsegmented …

TCAD device modelling and simulation of wide bandgap power semiconductors

N Lophitis, A Arvanitopoulos, S Perkins… - Disruptive Wide …, 2018 - books.google.com
Technology computer-aided Design (TCAD) is essential for devices technology
development, including wide bandgap power semiconductors. However, most TCAD tools …

Single event burnout hardening of enhancement mode HEMTs with double field plates

Z Zhen, C Feng, Q Wang, D Niu… - IEEE Transactions on …, 2021 - ieeexplore.ieee.org
Single event burnout (SEB) of enhancement mode GaN high-electron mobility transistors
(HEMTs) under heavy ion irradiation is systematically studied based on simulations in this …

Study of AlGaN/GaN vertical superjunction HEMT for improvement of breakdown voltage and specific on-resistance

M Zhang, Z Guo, Y Huang, Y Li, J Ma, X **a… - IEEE …, 2021 - ieeexplore.ieee.org
A GaN-based vertical superjunction high electron mobility transistor (SJ HEMT) with a
composite structure (CS-SJ HEMT) is proposed and analyzed by Silvaco TCAD to improve …

Research of single-event burnout and hardening of AlGaN/GaN-based MISFET

X Luo, Y Wang, Y Hao, X Li, CM Liu… - … on Electron Devices, 2019 - ieeexplore.ieee.org
This brief first time presents single-event burnout (SEB) simulation results for conventional
AlGaN/GaN gate field plate MISFET (GFP-C MISFET), simultaneously, a hardened MISFET …

Charge storage impact on input capacitance in p-GaN gate AlGaN/GaN power high-electron-mobility transistors

F Wang, W Chen, X Li, R Sun, X Xu, Y **n… - Journal of Physics D …, 2020 - iopscience.iop.org
In this paper, input capacitance (C ISS) of p-GaN gate AlGaN/GaN power high-electron-
mobility transistors (HEMTs) is systemically investigated. C ISS includes gate-to-source …

Simulation study of single-event burnout in GaN MISFET with Schottky element

Y Wang, XX Fei, X Wu, X Li, J Yang… - IEEE Transactions on …, 2020 - ieeexplore.ieee.org
In this article, we investigate a new hardened GaN MISFET with an integrated Schottky
contact (SC-MISFET). The new device architecture significantly improves the single-event …

Modeling power GaN-HEMTs using standard MOSFET equations and parameters in SPICE

U Jadli, F Mohd-Yasin, HA Moghadam, P Pande… - Electronics, 2021 - mdpi.com
The device library in the standard circuit simulator (SPICE) lacks a gallium nitride based
high-electron-mobility-transistor (GaN-HEMT) model, required for the design and verification …

An RF approach to modelling gallium nitride power devices using parasitic extraction

N Hari, S Ramasamy, M Ahsan, J Haider… - Electronics, 2020 - mdpi.com
This paper begins with a comprehensive review into the existing GaN device models.
Secondly, it identifies the need for a more accurate GaN switching model. A simple practical …