Unsteady adjoint of pressure loss for a fundamental transonic turbine vane
High-fidelity simulations, eg, large eddy simulation (LES), are often needed for accurately
predicting pressure losses due to wake mixing and boundary layer development in …
predicting pressure losses due to wake mixing and boundary layer development in …
MEMS packaging reliability in board-level drop tests under severe shock and impact loading conditions—Part II: Fatigue damage modeling
Damage in handheld electronic devices due to accidental drops is a critical reliability
concern. This paper is the second of a two-part series and focuses on damage models for …
concern. This paper is the second of a two-part series and focuses on damage models for …
Influence of secondary impact on printed wiring assemblies—Part II: Competing failure modes in surface mount components
Portable electronic devices are commonly exposed to shock and impact loading due to
accidental drops. After external impact, internal collisions (termed “secondary impacts” in …
accidental drops. After external impact, internal collisions (termed “secondary impacts” in …
Computational modeling and simulation for projectile impact and indentation of biological tissues and polymers
K Geiser - 2017 - dspace.mit.edu
Understanding the elastic and viscoelastic responses of biological soft tissues and
engineered polymer simulants is of great interest to predicting and preventing penetrative …
engineered polymer simulants is of great interest to predicting and preventing penetrative …
Nanowires for 3d silicon interconnection–low temperature compliant nanowire-polymer film for z-axis interconnect
J Tao - 2016 - cora.ucc.ie
Semiconductor chip packaging has evolved from single chip packaging to 3D
heterogeneous system integration using multichip stacking in a single module. One of the …
heterogeneous system integration using multichip stacking in a single module. One of the …