During the past decades, series of lead-free solders have been developed rapidly, and are
considered as the attractive interconnection materials replacing traditional Sn-Pb solders in …

Lead-free solder research has witnessed a great jump in the past decades due to the
increased restrictions over the use of toxic lead-bearing solder alloys. Among the …

Ceramic to metal joining has its potential applications in microelectronics packaging, metal–
ceramic seals, vacuum tubes, sapphire metal windows, etc. But there are many limitations in …

Brazing fillers for joining applications are essential for manufacturing and designing
advanced materials. Several types of brazing fillers have been developed in recent decades …

With the rapid development of electronical products, many primary challenges arise in the
field of design and manufacture, among which the property of electronical packaging …

In this study, different weight fractions (0, 0.2, 0.5, 0.7, and 1.0 wt%) of cerium oxide (CeO 2)
nanoparticles were used to enhance the properties of Sn–58Bi–1Ag (SBA) solder alloys. As …

Surface roughness is an important factor that affects the wetting of molten metal on ceramics.
The effect of surface roughness of the alumina substrate on the contact angle, contact …

With the miniaturization of solder joints and deterioration of serving environment, much effort
had been taken to improve the properties of Sn‐based lead‐free solders. And the fabrication …

Epoxy solder pastes are widely used in microelectronic packaging for joining die,
interconnects, screen displays and as a heat dissipaters. Due to their simplicity and high …

In this work, we have attempted to develop the Ag‐Cu‐Ti filler for bonding ZrO2 to Ti‐6Al‐
4V. The CeO2 nanoparticles were reinforced in the eutectic Ag‐Cu‐Ti filler via mechanical …