Continuous ongoing development of dense integrated circuits requires significant
advancements in nanoscale patterning technology. As a key process in semiconductor high …

Zeolitic imidazolate frameworks (ZIFs) are a subset of metal–organic frameworks with more
than 200 characterized crystalline and amorphous networks made of divalent transition …

While chemically amplified resists (CARs) have been dominating the semiconductor
industries over the past few decades, particularly in the area of computer chip fabrication …

Extreme ultraviolet (EUV) lithography at 13.5 nm is the main candidate for patterning
integrated circuits and reaching sub-10-nm resolution within the next decade. Should …

The semiconductor industry has already entered the sub-10 nm region, which has led to the
development of cutting-edge fabrication tools. However, there are other factors that hinder …

The development of new resist materials is vital to fabrication techniques for next-generation
microelectronics. Inorganic resists are promising candidates because they have higher etch …

Hf-based hybrid photoresist materials with three different organic ligands were prepared by
a sol–gel-based method, and their patterning mechanism was investigated in detail. All …

All nanofabrication methods come with an intrinsic resolution limit, set by their governing
physical principles and instrumentation. In the case of extreme ultraviolet (EUV) lithography …

Zirconium and hafnium in the tetravalent oxidation state are considered the two most similar
elements on the periodic table, based on their coexistence in nature and their identical solid …

This work shows a great influence on the EUV performance of hafnium carboxylate clusters
via slight structural modification. Treatment of hexameric hafnium clusters Hf6O4 (OH) 4 …