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The impact of electromigration in copper interconnects on power grid integrity
Electromigration (EM), a growing problem in on-chip interconnects, can cause wire
resistances in a circuit to increase under stress, to the point of creating open circuits …
resistances in a circuit to increase under stress, to the point of creating open circuits …
Probabilistic wire resistance degradation due to electromigration in power grids
Electromigration (EM) is a growing concern in on-chip interconnects, particularly in the
computing and automotive domains. EM can cause wire resistances in a circuit to increase …
computing and automotive domains. EM can cause wire resistances in a circuit to increase …
Statistical study of electromigration in gold interconnects
During operation of integrated circuits, electromigration gradually degrades the metallic
interconnects, eventually leading to complete failure. In recent decades, electromigration …
interconnects, eventually leading to complete failure. In recent decades, electromigration …
Airgap integration on patterned metal lines for advanced interconnect performance scaling
A novel process scheme combining airgap integration with patterned metal lines is
introduced. Scheme feasibility is demonstrated on interconnect pitches targeting for 2nm …
introduced. Scheme feasibility is demonstrated on interconnect pitches targeting for 2nm …
Electromigration Degradation of Gold Interconnects: A Statistical Study
Electromigration induced degradation of gold metallization used for GaAs devices is a
significant, but not sufficiently investigated phenomenon. In this work, a complete physics …
significant, but not sufficiently investigated phenomenon. In this work, a complete physics …
Impact of Gold Interconnect Microstructure on Electromigration Failure Time Statistics
Simulating the influence of microstructure on the electromigration reliability of a metallic
interconnect is a challenging task due to the complexity of grain boundary physics and to the …
interconnect is a challenging task due to the complexity of grain boundary physics and to the …
[PDF][PDF] Finite Size Effects in Platinum-group Metal Nanostructures
S Dutta - 2018 - lirias.kuleuven.be
Conductivity of nanostructures differ significantly from the bulk. One such manifestation is the
resistivity scaling where the resistivity of metallic nanostructures increases drastically when …
resistivity scaling where the resistivity of metallic nanostructures increases drastically when …
Tradeoffs Between Performance and Reliability in Integrated Circuits
DJ Weyer - 2019 - rave.ohiolink.edu
Abstract The Reliability of the ICs or ASICs was assumed to always exceed the expected life-
time of the product. Reliability cannot be ignored as the IC/ASIC industry moves to nano …
time of the product. Reliability cannot be ignored as the IC/ASIC industry moves to nano …
Dégradation par électromigration dans les interconnexions en cuivre: étude des facteurs d'amélioration des durées de vie et analyse des défaillances précoces
FL Bana - 2013 - theses.hal.science
Les circuits intégrés sont partie prenante de tous les secteurs industriels et de la vie
couranteactuels. Leurs dimensions sont sans cesse réduites afin d'accroître leurs …
couranteactuels. Leurs dimensions sont sans cesse réduites afin d'accroître leurs …
Розмірний ефект у розподілі часів до відмови припойних з'єднань
ОЮ Ляшенко - Вісник Черкаського університету. Серія: Фізико …, 2012 - irbis-nbuv.gov.ua
Розмірний ефект у розподілі часів до відмови припойних з'єднань/ОЮ Ляшенко//Вісник
Черкаського університету. Серія: Фізико-математичні науки.-2012.-№ 229.-С. 23-31 …
Черкаського університету. Серія: Фізико-математичні науки.-2012.-№ 229.-С. 23-31 …