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Copackaging of ASIC and silicon photonics
GC Byrd, DA Nelson, J Messian… - US Patent 10,365,436, 2019 - Google Patents
(57) ABSTRACT A system and method for packing optical and electronic components. A
module includes an electronic integrated circuit and a plurality of photonic integrated …
module includes an electronic integrated circuit and a plurality of photonic integrated …
Photonic package with a bridge between a photonic die and an optical coupling structure
B **e - US Patent 10,598,875, 2020 - Google Patents
Disclosed herein are photonic package assemblies, packages, and devices that include
photonic dies and optical coupling structures aligned with photonic dies to enable exchange …
photonic dies and optical coupling structures aligned with photonic dies to enable exchange …
Integration of silicon photonics IC for high data rate
H Liu, R Urata, W seong Kwon, T Kang - US Patent 10,025,047, 2018 - Google Patents
Signal integrity in high-speed applications is dependent on both the underlying device
performance and electronic packaging methods. The maturity of chip-on-board (COB) …
performance and electronic packaging methods. The maturity of chip-on-board (COB) …
Universal photonic adaptor for coupling an optical connector to an optoelectronic substrate
A Matiss, JS Sutherland - US Patent 10,795,086, 2020 - Google Patents
A photonic adaptor has a first face side to couple the photonic adaptor to an optical
connector and a second face side to couple the photonic adaptor to an optoelectronic …
connector and a second face side to couple the photonic adaptor to an optoelectronic …
Module with transmit and receive optical subassemblies with specific pic cooling architecture
GC Byrd, CT Chou, K Muth - US Patent 10,761,262, 2020 - Google Patents
An optoelectronic module. In some embodiments, the mod ule includes: a housing, a
substantially planar subcarrier, a photonic integrated circuit, and an analog electronic inte …
substantially planar subcarrier, a photonic integrated circuit, and an analog electronic inte …
Frame lid for in-package optics
VK Patel, AR Prasad, S Razdan - US Patent 11,029,475, 2021 - Google Patents
The present disclosure provides a frame lid assembly, which may be used in assembling an
optical platform to provide isolated thermal conduction paths for various elements thereof …
optical platform to provide isolated thermal conduction paths for various elements thereof …
Fiberless co-packaged optics
A Israel, H Taha - US Patent 11,585,991, 2023 - Google Patents
8,471.467 B2 6/20 13 Boemer KR. 2 ()|| 7 ()() 8|| 265 A 7/2 () 17 8.548. 287 B2 10/2013
Thacker et al. RU 2438209 (C| 12/2 () 11 8.582. 934 B2 11/2013 Adler et al. RU 2485688 …
Thacker et al. RU 2438209 (C| 12/2 () 11 8.582. 934 B2 11/2013 Adler et al. RU 2485688 …
Copackaging of asic and silicon photonics
GC Byrd, DA Nelson, J Messian, TP Schrans… - US Patent …, 2020 - Google Patents
(57) ABSTRACT A system and method for packing optical and electronic components. A
module includes an electronic integrated circuit and a plurality of photonic integrated …
module includes an electronic integrated circuit and a plurality of photonic integrated …
Optical module
G Du, T Yongzheng, T Wu, J Mu, S Sui… - US Patent …, 2023 - Google Patents
Page 2 box. The top plane is in contact with the upper enclosure part for heat dissipation, so
as to help heat generated by the laser chip be conducted to the upper enclosure part via the …
as to help heat generated by the laser chip be conducted to the upper enclosure part via the …
Modular optical device and modules therefor
P Dong, G Charlet - US Patent 10,175,422, 2019 - Google Patents
(57) ABSTRACT A modular optical device having a set of optoelectronic modules that
enables the device to operate, eg, as a WDM or multichannel transceiver. In an example …
enables the device to operate, eg, as a WDM or multichannel transceiver. In an example …