This paper comprehensively examines developments in bifurcated microchannels, focusing
on their role in boosting heat transfer and fluid flow efficiency in thermal management …

Hybrid jet microchannel cooling can improve the non-uniform temperature distribution,
significant pressure drop in microchannel, and the uneven heat transfer coefficient in jet …

Phase change material heat sink can be used to effectively cool electronic device, and
internal pin-fins can be utilized to improve heat transfer process. However, the latent heat …

In order to address the growing severe thermal management issues in high-power-density
3D Integrated Circuits, a model was created to compare single-layer modeling with multi …

This study evaluates a heat exchanger design that combines the advantages of fractal
systems, known for their efficiency in fluid transport, with sinusoidal channels, recognized for …

Miniaturization and integration in electronic devices have caused a rapid increase in heat
flux. Dissipation of high heat flux from devices for uniform temperature is essentially required …

This paper analyses the characteristics of temperature, velocity and pressure loss of various
channel configurations with identical Reynolds Number Re. A comparative analysis is …

To prevent power equipment from breaking down due to overheating, an innovative design
of twisted blade-like fins for heat sinks is proposed to enhance heat transfer efficiency and …

The substrate temperature gradient of electronic devices not only affects their performance,
but also reduces their reliability and service life. In order to get a more uniform temperature …

With the miniaturization of electronic chips, and the complexity and diversity of functions, the
application of multiple heat source arrays has appeared in recent years. In order to improve …