Thermal management and packaging of wide and ultra-wide bandgap power devices: a review and perspective

Y Qin, B Albano, J Spencer, JS Lundh… - Journal of physics D …, 2023 - iopscience.iop.org
Power semiconductor devices are fundamental drivers for advances in power electronics,
the technology for electric energy conversion. Power devices based on wide-bandgap …

Recent progress on the electronic structure, defect, and do** properties of Ga2O3

J Zhang, J Shi, DC Qi, L Chen, KHL Zhang - APL Materials, 2020 - pubs.aip.org
ABSTRACT Gallium oxide (Ga2O3) is an emerging wide bandgap semiconductor that has
attracted a large amount of interest due to its ultra-large bandgap of 4.8 eV, a high …

[HTML][HTML] β-Gallium oxide power electronics

AJ Green, J Speck, G **ng, P Moens, F Allerstam… - Apl Materials, 2022 - pubs.aip.org
Gallium Oxide has undergone rapid technological maturation over the last decade, pushing
it to the forefront of ultra-wide band gap semiconductor technologies. Maximizing the …

High thermal conductivity in wafer-scale cubic silicon carbide crystals

Z Cheng, J Liang, K Kawamura, H Zhou… - Nature …, 2022 - nature.com
High thermal conductivity electronic materials are critical components for high-performance
electronic and photonic devices as both active functional materials and thermal …

Tunable anisotropic thermal transport in porous carbon foams: The role of phonon coupling

XK Chen, XY Hu, P Jia, ZX **e, J Liu - International Journal of Mechanical …, 2021 - Elsevier
Carbon foams (CFs) possess high storage capacity, good electronic conductivity and superb
mechanical strength, which demonstrate promising applications in many engineering fields …

Recent progress of Ga2O3 power technology: large-area devices, packaging and applications

Y Qin, Z Wang, K Sasaki, J Ye… - Japanese Journal of …, 2023 - iopscience.iop.org
Benefitted from progress on the large-diameter Ga 2 O 3 wafers and Ga 2 O 3 processing
techniques, the Ga 2 O 3 power device technology has witnessed fast advances toward …

Bonding‐Enhanced Interfacial Thermal Transport: Mechanisms, Materials, and Applications

XD Zhang, G Yang, BY Cao - Advanced Materials Interfaces, 2022 - Wiley Online Library
Rapid advancements in nanotechnologies for energy conversion and transport applications
urgently require a further understanding of interfacial thermal transport and enhancement of …

A critical review of thermal boundary conductance across wide and ultrawide bandgap semiconductor interfaces

T Feng, H Zhou, Z Cheng, LS Larkin… - ACS applied materials …, 2023 - ACS Publications
The emergence of wide and ultrawide bandgap semiconductors has revolutionized the
advancement of next-generation power, radio frequency, and opto-electronics, paving the …

The dawn of Ga2O3 HEMTs for high power electronics-A review

R Singh, TR Lenka, DK Panda, RT Velpula… - Materials Science in …, 2020 - Elsevier
Recently, there is a growing interest in Gallium Oxide (Ga 2 O 3) as a promising
semiconductor material for intended applications in RF, power electronics, and sensors with …

Interfacial thermal conductance across room-temperature-bonded GaN/diamond interfaces for GaN-on-diamond devices

Z Cheng, F Mu, L Yates, T Suga… - ACS applied materials & …, 2020 - ACS Publications
The wide bandgap, high-breakdown electric field, and high carrier mobility makes GaN an
ideal material for high-power and high-frequency electronics applications, such as wireless …