Structure and properties of Sn-Cu lead-free solders in electronics packaging
M Zhao, L Zhang, ZQ Liu, MY ** on elastic properties, fracture toughness, electronic properties, and thermal conductivity of η'-Cu6Sn5 in Sn-Cu solder: A first-principles calculation
S Xu, A Yang, Y Duan, M Li, M Peng - Materials Today Communications, 2023 - Elsevier
The phase stability, elastic properties, fracture toughness, electronic structure and thermal
conductivity of Ni-doped η'-Cu 6 Sn 5 have been obtained using first-principles calculations …
conductivity of Ni-doped η'-Cu 6 Sn 5 have been obtained using first-principles calculations …
Effects of Ag content on the interfacial reactions between liquid Sn–Ag–Cu solders and Cu substrates during soldering
The effects of Ag content on the interfacial reactions between Sn–Ag–Cu (SAC) solders and
Cu substrates during soldering were studied based on an experiment in which the liquid …
Cu substrates during soldering were studied based on an experiment in which the liquid …
Study on corrosion behavior of β-Sn and intermetallic compounds phases in SAC305 alloy by in-situ EC-AFM and first-principles calculation
P Yi, C Dong, K **ao, X Li - Corrosion Science, 2021 - Elsevier
This work studies the corrosion behavior of β-Sn and intermetallic compounds (IMCs) in
Sn96. 5Ag3. 0Cu0. 5 (SAC305) alloy through micro-structure observation, in-situ …
Sn96. 5Ag3. 0Cu0. 5 (SAC305) alloy through micro-structure observation, in-situ …
Effects of cobalt on the nucleation and grain refinement of Sn-3Ag-0.5 Cu solders
We show that cobalt-microalloying causes significant grain refinement in large samples (60
g) of Sn-3Ag-0.5 Cu solder. Nucleation occurs on the (100) facet of αCoSn 3 crystals with a …
g) of Sn-3Ag-0.5 Cu solder. Nucleation occurs on the (100) facet of αCoSn 3 crystals with a …
Anisotropic thermal expansion of Ni3Sn4, Ag3Sn, Cu3Sn, Cu6Sn5 and βSn
The directional coefficient of thermal expansion (CTE) of intermetallics in electronic
interconnections is a key thermophysical property that is required for microstructure-level …
interconnections is a key thermophysical property that is required for microstructure-level …