Abstract Sn-Ag-Cu system lead-free solders are considered to be promising solder series.
The growth of Sn whiskers on the solder surface is an important factor that threatens the …

In the service of electronic products, owing to thermal cycling and external additional loads,
solder joints undergo thermomechanical coupled cyclic loading. To fully understand the …

This paper examines multiscale theories and numerical methods for interconnect materials
in electronic packaging, focusing on the interplay among micro-scale morphology, meso …

The impacts of SiC on the wettability, mechanical properties and growth of intermetallic
compound (IMC) of the low silver Sn-0.3 Ag-0.7 Cu (SAC0307)–xSiC composite solders …

The necessities of lead-free solder alloys have been expanded by the advent of eco-friendly
technologies of microelectronic packaging industry. Mostly lead-free solder alloys are SAC …

With the advent of environment friendly microelectronic packaging technologies, the
demand of lead-free solders alloy has escalated. Leadfree solder material is an alloy of Tin …

The implementation of environment friendly technologies in microelectronic packaging
industry has widened the essentialities of lead-free solder alloys. The Cu 3 Sn intermetallic …

Sn and its compounds have been widely used in the field of new energy, the photovoltaic
material and thermal stabilizer, however the traditional empirical potential and other …

Abstract Fe–Cr–Al alloy is one of the candidate materials for reactor fuel cladding due to
excellent high-temperature oxidation resistance; however, it has significant irradiation …

Intermetallic compounds (IMCs) are inevitable byproducts during the soldering of
electronics. Cu6Sn5 is one of the main components of IMCs, and its mechanical properties …