The aviation industry is increasingly interested in high-efficiency and high-density electric
propulsion systems enabled by high-power silicon carbide (SiC) modules. However …

The interfacial electrical tree (IET) between the packaging insulation and the ceramic
substrate is easily initiated by a high electric field around the triple point in the power …

A Monte Carlo statistical tolerance analysis is conducted on a parallel-plate, wirebond-less
multichip power module (MCPM) to analyze the planarity across modules with post …

The efficiency and power density of power conversion systems can be greatly improved by
utilizing gallium nitride high-electron-mobility transistors (GaN HEMTs) due to their ultra-low …

To tackle the insulation challenges present in packaging medium-voltage (MV) silicon
carbide (SiC) power devices, we developed a package design for a 20-kV SiC. This design …

Dielectrically graded insulation (DGI) with spatially inhomogeneous dielectric parameter
distribution can provide extraordinary insulation performance for high-voltage power …

Medium-voltage silicon carbide power modules have the potential to enable a more
renewable, resilient, and reliable electric grid. However, their electrical insulation, especially …

Packaging of medium-voltage power semiconductor devices is challenging because the
insulation materials are demanded to withstand extremely high electric-field stresses as well …

This paper studies the impacts of the bottom copper layer of direct-bond copper (DBC)
substrates on the partial discharge (PD) performance of the power modules. Finite element …

Emerging medium-voltage silicon carbide devices offer the potential to achieve more
efficient and compact power electronics for grid-tied applications. However, the lack of an …