A brief overview of the rapid progress and proposed improvements in gallium nitride epitaxy and process for third-generation semiconductors with wide bandgap

AC Liu, YY Lai, HC Chen, AP Chiu, HC Kuo - Micromachines, 2023 - mdpi.com
In this paper, we will discuss the rapid progress of third-generation semiconductors with
wide bandgap, with a special focus on the gallium nitride (GaN) on silicon (Si). This …

2.5 A/mm/350 GHz aggressively scaled gate engineered Fe-doped AlN/GaN channel HEMT with graded InGaN Backbarrier on SiC-wafer for next generation RF …

B Mounika, J Ajayan, S Bhattacharya - Materials Science and Engineering …, 2024 - Elsevier
This study intends to investigate the effects of barrier scaling, a crucial RF GaN-HEMT
design element, which is imperative to achieve enhanced performance at nano-scale …

A Review of GaN Channel-Based MOSHEMTs for Next-Generation Medium/Low-Voltage Rating and High-Speed RF Power Applications

G Deshpande, S Bhattacharya, J Ajayan… - Journal of Electronic …, 2024 - Springer
This comprehensive review delves into the intricate realm of GaN-based metal–oxide–
semiconductor (MOS) high-electron-mobility transistors (HEMTs), providing an exhaustive …

Investigation on effect of AlN barrier thickness and lateral scalability of Fe-doped recessed T-gate AlN/GaN/SiC HEMT with polarization-graded back barrier for future …

B Mounika, J Ajayan, S Bhattacharya, D Nirmal… - Microelectronics …, 2023 - Elsevier
In this study, the influence of AlN barrier thickness (tb) on the RF & DC performances of 50
nm recessed T-gate Fe-doped AlN/GaN/SiC HEMT is investigated. The proposed HEMT …

An intensive study on effects of lateral scaling and gate metals on the RF/DC performance of recessed T-gated Fe-doped AlN/GaN/SiC HEMTs for future RF and …

B Mounika, J Ajayan, S Bhattacharya - Microelectronic Engineering, 2023 - Elsevier
In this simulation work, the effect of Al x Ga 1-x N and In x Ga 1-x N back barriers (BB) on the
RF & DC performances of recessed T-gated Fe-doped AlN/GaN/SiC HEMT device is …

[HTML][HTML] LG= 50 nm T-gated and Fe-doped double quantum well GaN‒HEMT on SiC wafer with graded AlGaN barrier for future power electronics applications

B Mounika, J Ajayan, S Bhattacharya, D Nirmal… - Journal of Science …, 2024 - Elsevier
High-performance LG= 50 nm graded double-channel (GDC)-HEMT featuring AlN top
barrier, recessed T-gate and graded-AlGaN bottom barrier is designed and investigated …

Hybrid edge termination in vertical GaN: Approximating beveled edge termination via discrete implantations

T Nelson, P Pandey, DG Georgiev… - … on Electron Devices, 2022 - ieeexplore.ieee.org
This work examines a new hybrid edge termination structure for vertical GaN diodes. The
hybrid JTE-GR termination consists of superimposed guard rings (GRs) onto a junction …

Using machine learning with optical profilometry for GaN wafer screening

JC Gallagher, MA Mastro, MA Ebrish, AG Jacobs… - Scientific Reports, 2023 - nature.com
To improve the manufacturing process of GaN wafers, inexpensive wafer screening
techniques are required to both provide feedback to the manufacturing process and prevent …

Experimental Validation of Robust Hybrid Edge Termination Structures in Vertical GaN pin Diodes with Avalanche Capability

JS Lundh, AG Jacobs, P Pandey… - IEEE Electron …, 2024 - ieeexplore.ieee.org
Vertical gallium nitride (GaN) pin diodes with a planar hybrid edge termination (HET)
experimentally demonstrate avalanche capability. The HET consists of a nitrogen ion …

A Review of Homoepitaxy of III-Nitride Semiconductors by Metal Organic Chemical Vapor Deposition and the Effects on Vertical Devices

JK Hite - Crystals, 2023 - mdpi.com
This paper reviews some of the basic issues in homoepitaxial growth of III-nitrides to enable
a vertical device technology. It focuses on the use of metal organic chemical vapor …