The ambition of lab-on-a-chip (LOC) systems to achieve chip-level integration of a complete
analytical process capable of performing a complex set of biomedical protocols is hindered …

The recent advances and trends in heterogeneous integrations are presented in this study.
Emphasis is placed on:(A) the definition of heterogeneous integrations,(B) the classifications …

The first fan-out wafer-level packaging (FOWLP) US patent was filed by Infineon on October
31, 2001, and the first technical papers were also published (2006) by Infineon and their …

The design, materials, process, fabrication, and reliability of a heterogeneous integration of
four chips and four capacitors by a fan-out wafer-level packaging (FOWLP) method are …

Wafer-level heterogeneous integration technologies for microoptoelectromechanical
systems (MOEMS), microelectromechanical systems (MEMS), and nanoelectromechanical …

TION wileyonlinelibrary. com Adv. Mater. 2011, XX, 1–4 spreading and wetting of the printed
features. Hence, the waveguide cross-sections remain nearly cylindrical with a …

Fan-out wafer-level packaging for 3D IC heterogeneous integration Page 1 FAN-OUT
WAFER-LEVEL PACKAGING FOR 3D IC HETEROGENEOUS INTEGRATION John H Lau ASM …

Low-loss optical-coupling structures are highly relevant for applications in fields as diverse
as information and communication technologies, integrated circuits, or flexible and highly …

We propose and demonstrate directed optical digital logic function which can perform
several logic gates using a single microring resonator. The mode operations achieved are …

This study is for fan-out wafer-level packaging with chip-first (die face-up) formation. Chips
with Cu contact-pads on the front side and a die attach film on the backside are picked and …