Microprocessor design has recently encountered many constraints such as power, energy,
reliability, and temperature. Among these challenging issues, temperature-related issues …

Mobile and IoT devices have proliferated our daily lives. However, these miniaturized
computing systems should be highly energy-efficient due to their ultrasmall form factor …

Elevated temperatures limit the peak performance of systems because of frequent
interventions by thermal throttling. Non-uniform thermal states across system nodes also …

Managing the power consumption of computing platforms is a complicated problem thanks
to a multitude of hardware configuration options and characteristics. Much of the academic …

In this work we present an approach for markerless motion capture (MoCap) of articulated
objects, which are recorded with multiple unsynchronized moving cameras. Instead of using …

Execution time is no longer the only metric by which computational systems are judged. In
fact, explicitly sacrificing raw performance in exchange for energy savings is becoming a …

Technology scaling has caused the feature sizes to shrink continuously, whereas
interconnects, unlike transistors, have not followed the same trend. Designing 3D stack …

Recently, processor power density has been increasing at an alarming rate resulting in high
on-chip temperature. Higher temperature increases current leakage and causes poor …

Three-dimensional integration has the potential to improve the communication latency and
integration density of chip-level multiprocessors (CMPs). However, the stacked high-power …

Conventional thermal management techniques are reactive, as they take action after
temperature reaches a threshold. Such approaches do not always minimize and balance the …