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Electrochemical migration in electronic materials: factors affecting the mechanism and recent strategies for inhibition
Electrochemical migration (ECM) is one of the serious failure modes encountered in
electronic devices due to the electrochemical reactions triggered by the presence of …
electronic devices due to the electrochemical reactions triggered by the presence of …
Electrochemical migration of Sn and Sn solder alloys: a review
Sn and Sn solder alloys in microelectronics are the most susceptible to suffer from
electrochemical migration (ECM) which significantly compromises the reliability of …
electrochemical migration (ECM) which significantly compromises the reliability of …
Synergy of Cu and Sb to enhance the resistance of 3% Ni weathering steel to marine atmospheric corrosion
Various contents of Cu and Sb elements were incorporated into 3% Ni steel to enhance its
corrosion resistance in a simulated tropical marine atmosphere of high salinity. The …
corrosion resistance in a simulated tropical marine atmosphere of high salinity. The …
Improving the resistance of high-strength steel to SCC in a SO2-polluted marine atmosphere through Nb and Sb microalloying
A series of high-strength steels microalloyed with Nb and Sb were prepared via vacuum
melting and hot rolling, and their resistance to stress corrosion cracking (SCC) was …
melting and hot rolling, and their resistance to stress corrosion cracking (SCC) was …
Test methods for electrochemical migration: a review
X Zhong, S Yu, L Chen, J Hu, Z Zhang - Journal of Materials Science …, 2017 - Springer
There are three main test methods used in the study of electrochemical migration, ie, thermal
humidity bias (THB) test, water drop (WD) test and thin electrolyte layer (TEL) test. However …
humidity bias (THB) test, water drop (WD) test and thin electrolyte layer (TEL) test. However …
Effect of bias potential and dimension on electrochemical migration of capacitors for implantable devices
Dendrite formation induced by electrochemical migration (ECM) is a common reliability
problem occurring on printed circuit boards (PCBs), which significantly threatens the long …
problem occurring on printed circuit boards (PCBs), which significantly threatens the long …
[HTML][HTML] In situ study the effects of bias and electric field intensity on electrochemical migration behavior of Sn96. 5Ag3. 0Cu0. 5 solder alloy
P Yi, Z Yang, W Wang, T Zhang, J Xu, K **ao… - Journal of Materials …, 2023 - Elsevier
In this work, the influence of bias and electric field intensity on the electrochemical migration
of SAC305 solder alloy is investigated using a self-designed in-situ thin electrolyte film …
of SAC305 solder alloy is investigated using a self-designed in-situ thin electrolyte film …
Kinetic analysis of Cu and Zn dissolution from printed circuit board physical processing dust under oxidative ammonia leaching
A very selective leach for an assorted material stream such as the PCB dust is a vital
process step to achieve less complex downstream processing. Thermodynamically …
process step to achieve less complex downstream processing. Thermodynamically …
Effect of micromorphology on corrosion and mechanical properties of SAC305 lead-free solders
G Chen, XH Wang, J Yang, WL Xu, Q Lin - Microelectronics Reliability, 2020 - Elsevier
The aim of this study is to investigate the effects of variable micromorphology on the
corrosion and mechanical properties of Sn-3.0 Ag-0.5 Cu (SAC305) solder alloy. Different …
corrosion and mechanical properties of Sn-3.0 Ag-0.5 Cu (SAC305) solder alloy. Different …
Corrosion insight of iron and bismuth added Sn–1Ag–0.5 Cu lead-free solder alloy
The present study attempted to assess the corrosion performance of iron (Fe) and bismuth
(Bi) added Sn–1Ag–0.5 Cu (SAC105) lead-free solder alloy in NaCl-based solutions …
(Bi) added Sn–1Ag–0.5 Cu (SAC105) lead-free solder alloy in NaCl-based solutions …