Failure mechanisms in flexible electronics

Z Zhao, H Fu, R Tang, B Zhang, Y Chen… - International Journal of …, 2023 - Taylor & Francis
The rapid evolution of flexible electronic devices promises to revolutionize numerous fields
by expanding the applications of smart devices. Nevertheless, despite this vast potential, the …

Recent advances in reverse offset printing: an emerging process for high-resolution printed electronics

Y Kusaka, N Fukuda, H Ushijima - Japanese journal of applied …, 2020 - iopscience.iop.org
Mechanisms, materials, and processes of high-resolution printing techniques dedicated to
printed electronics are reviewed. Advanced printing methods, including reverse offset …

Microstructure evolution and failure mechanism of electromigration in Ag-alloy bonding wire

CH Chen, PI Lee, TH Chuang - Journal of Alloys and Compounds, 2022 - Elsevier
Ag-alloy bonding wire has excellent physical properties and is widely applied in
microelectronics, but growing concerns about circuit failure induced by electromigration …

Electromigration behavior of screen-printing silver nanoparticles interconnects

WH Lin, FY Ouyang - Jom, 2019 - Springer
Printing technology is one of the promising patterning techniques in flexible electronic
devices due to its low cost and large-area patternability. In this study, the electromigration …

Electromigration damage of flexible electronic lines printed with Ag nanoparticle ink

D Saito, K Sasagawa… - Journal of …, 2020 - asmedigitalcollection.asme.org
Flexible printed circuits (FPCs) are widely used in electronic equipment such as mobile
devices and wearable sensors. The conductive electric lines in these circuits are printed …

[HTML][HTML] Current-induced changes of surface morphology in printed Ag thin wires

Q Sun, Y Lu, C Tang, H Song, C Li, C Zuo - Materials, 2019 - mdpi.com
Current-induced changes of surface morphology in printed Ag thin wires were investigated
by current stressing tests and numerical simulation. The samples were printed Ag thin wires …

Electromigration and electrical sintering in printed silver from high current at room temperature

U Jung, R Wagner - Flexible and Printed Electronics, 2024 - iopscience.iop.org
Improved understanding of the reliability and failure physics of metal nanoparticle
conductive inks would facilitate their large-scale deployment across a range of flexible …

A simple technique to prevent electromigration damage in printed Ag thin wires

X Xu, Y Lu, C Tang, Q Sun, F Huang - Materials Letters, 2018 - Elsevier
In this work, we present a simple technique to prevent electromigration damage in printed
Ag thin wires. The Ag thin wire can be protected by a silicone rubber layer during current …

Electromigration failure in inkjet-printed Ag conductive lines

P Jepiti, S Yoon, J Kim - Flexible and Printed Electronics, 2023 - iopscience.iop.org
Electromigration (EM) is crucial to the reliability of most conductive lines used in electronics.
In the present study, the EM characteristics of inkjet-printed Ag conductive lines were …

Effect of insulating layer on damage of flexible Ag nanoparticle line under high-density electric current

T KUDO, K SASAGAWA, K FUJISAKI… - Mechanical Engineering …, 2024 - jstage.jst.go.jp
The demand for printed electronics is increasing with the development of flexible devices.
Flexible electric line printed with metal nanoparticle ink is widely used. Electromigration …