Recently, the need for miniaturization and high integration have steered a strong technical
wave in develo** (micro‐) electronic devices. However, excessive amounts of heat may …

The proliferation of high-power, highly informationized, and highly integrated electronic
devices and weapons equipment has given rise to increasingly conspicuous issues about …

Multifunctional phase change materials (PCMs) simultaneously combining high-efficiency
thermal management and electromagnetic interference (EMI) shielding performance are …

Interface thermal resistance has become a crucial barrier to effective thermal management
in high-performance electronics and sensors. The growing complexity of operational …

The rapid advancement of communication technology has substantially increased the
demand for advanced electronic packaging materials with high thermal conductivity and …

With the continuous advancement of electronic devices, there is an urgent need for
advanced thermal interface materials (TIMs) to prevent high-power density electronics from …

Thermal management has become increasingly critical in a broad range of applications,
including cooling electronic devices, regulating body temperature, harvesting solar energy …

The miniaturization, integration, and high data throughput of electronic chips present
challenging demands on thermal management, especially concerning heat dissipation at …

Thermal interface materials are crucial for addressing the hot issues of a rapid increase in
thermal density in narrow and limited service spaces. Flexible and designable epoxy resin …

Exploiting an advanced phase change material (PCM) isochronally combining superior
thermal conductivity (TC) and electromagnetic interference shielding efficiency (EMI SE) is in …