In order to meet the requirements of high performance, miniaturization, low cost, low power
consumption and multi-function, three-dimensional (3D) integrated technology has gradually …

While 3-D integrated circuits (ICs) offer many advantages over 2-D ICs, thermal
management challenges remain unresolved. Thermal through-silicon-vias (TTSVs) are …

This paper proposed a new heat dissipation structure called double-layer triangular micro-
channel (DLTMC) to solve the increasingly serious thermal problem of three-dimensional …

Thermal issue has significant effect on the reliability and performance of integrated circuits
with the increase of integrated density, especially for 2.5-D and 3-D heterogeneous …

Thermal issue is a quite critical factor in influencing the performance of integrated circuits
(ICs) with the increase of the device integration density. Through silicon via (TSV) and bump …

This paper applies the carbon materials (ie, SWCNT, MWCNT, and GNR) as new
prospective filler materials of through silicon vias (TSV) for replacing the conventional …

Since accurate thermal analysis is essential for the design and thermal management of
System-in-Package (SiP). This paper proposes a transient thermal analysis of the System-in …

Since accurate thermal analysis plays a critical role in the thermal design and management
of the 3-D system-level integration, in this paper, a discontinuous Galerkin time-domain …

To investigate the thermal behavior of 3-D integrated circuits, long computational times are
required for large-scale stacked chips with a complicated structure. In this paper, an …

In this article, an efficient approach based on Laguerre-based finite-element method
(LBFEM) is proposed for transient thermal simulation of integrated circuits (ICs) and …