The objective of this review is to study the effect of minor alloying and impurity elements,
typically present in electronics manufacturing environment, on the interfacial reactions …

The present review article evaluates the research and progress status of Cu–Ni–Sn-based
spinodal alloys focussed on the methods and technologies implemented to enhance the …

Liquid metal nanodroplets are an emerging class of underexplored materials with significant
potential in many applications, including catalysis, bio‐therapeutics, and phase‐change …

Rapid formation of complete intermetallic-phases (IPs)-composed joints during die bonding
for high temperature applications was achieved by pressureless and fluxless ultrasonic …

A method of limiting cracking in the Cu 6 Sn 5 intermetallic compounds (IMCs) at the
interface between lead-free solders and copper substrates has been developed. To explore …

In this study, Ni foam, Cu coated Ni foam and Cu-Ni alloy foams were used as strengthening
phases for pure Sn solder. Cu-Cu joints were fabricated by soldering with these Sn-based …

The effect of Ag, Fe, Au and Ni on the interfacial reactions between Sn-based solder and Cu
substrate has been investigated in this paper. Based on the solubility of the alloying …

High temperature solders have experienced a marked increase in demand due to the boom
of high power interconnects in electric vehicles and the miniaturisation of electronic devices …

Cobalt chromium is widely used to make medical implants and wind turbine, engine and
aircraft components because of its high wear and corrosion resistance. The ability to process …

Abstract In this study, Ni-Cu/SAC composite solders with different Cu contents were used as
an interlayer to solder Al alloy joints at 250℃ for different time. The results showed that the …