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Thermal management and packaging of wide and ultra-wide bandgap power devices: a review and perspective
Power semiconductor devices are fundamental drivers for advances in power electronics,
the technology for electric energy conversion. Power devices based on wide-bandgap …
the technology for electric energy conversion. Power devices based on wide-bandgap …
Ultra-Wide Band Gap Ga2O3-on-SiC MOSFETs
Ultra-wide band gap semiconductor devices based on β-phase gallium oxide (Ga2O3) offer
the potential to achieve higher switching performance and efficiency and lower …
the potential to achieve higher switching performance and efficiency and lower …
A comprehensive review of recent progress on enhancement-mode β-Ga2O3 FETs: Growth, devices and properties
B Li, X Zhang, L Zhang, Y Ma, W Tang… - Journal of …, 2023 - iopscience.iop.org
Power electronic devices are of great importance in modern society. After decades of
development, Si power devices have approached their material limits with only incremental …
development, Si power devices have approached their material limits with only incremental …
Transient thermal management of a β-Ga₂O₃ MOSFET using a double-side diamond cooling approach
-phase gallium oxide (-Ga2O3) has drawn significant attention due to its large critical electric
field strength and the availability of low-cost high-quality melt-grown substrates. Both …
field strength and the availability of low-cost high-quality melt-grown substrates. Both …
Device-level thermal analysis for gallium oxide lateral field-effect transistor
Y Mao, B Meng, Z Qin, B Gao… - IEEE Transactions on …, 2023 - ieeexplore.ieee.org
Poor intrinsic thermal conductivity (TC) of beta-phase gallium oxide (-Ga2O3) poses
challenges to the thermal management of its devices. Various packaging-level cooling …
challenges to the thermal management of its devices. Various packaging-level cooling …
Simulation study on single-event burnout in field-plated Ga2O3 MOSFETs
C Yu, H Guo, Y Liu, X Wu, L Zhang, X Tan, Y Han… - Microelectronics …, 2023 - Elsevier
This paper presents the 2-D numerical simulation results of the heavy-ion induced single-
event burnout (SEB) and single event gate rupture (SEGR) in the depletion-mode gallium …
event burnout (SEB) and single event gate rupture (SEGR) in the depletion-mode gallium …
Thermal analysis of an α-Ga2O3 MOSFET using micro-Raman spectroscopy
The ultra-wide bandgap (UWBG) energy (∼ 5.4 eV) of α-phase Ga 2 O 3 offers the potential
to achieve higher power switching performance and efficiency than today's power electronic …
to achieve higher power switching performance and efficiency than today's power electronic …
Differentiating contribution of electron–phonon coupling to the thermal boundary conductance of metal–metal–dielectric systems
B Meng, C Yuan - Applied Physics Letters, 2024 - pubs.aip.org
Electron–phonon coupling thermal resistance in metals is a key factor affecting the thermal
boundary conductance (TBC) of metal–metal–dielectric systems. However, quantitatively …
boundary conductance (TBC) of metal–metal–dielectric systems. However, quantitatively …
[HTML][HTML] Simulation on an Advanced Double-Sided Cooling Flip-Chip Packaging with Diamond Material for Gallium Oxide Devices
H Guan, D Wang, W Li, D Liu, B Deng, X Qu - Micromachines, 2024 - mdpi.com
Gallium oxide (Ga2O3) devices have shown remarkable potential for high-voltage, high-
power, and low-loss power applications. However, thermal management of packaging for …
power, and low-loss power applications. However, thermal management of packaging for …
Three-dimensional thermal analysis of heterogeneously integrated β-Ga2O3-on-SiC SBDs using Raman thermography and electrothermal modeling
β-Ga 2 O 3, despite its ultra-wide bandgap and excellent electrical properties, requires
heterogeneous integration with high thermal conductivity substrates like SiC for high-power …
heterogeneous integration with high thermal conductivity substrates like SiC for high-power …