[HTML][HTML] Reliability, applications and challenges of GaN HEMT technology for modern power devices: A review

N Islam, MFP Mohamed, MFAJ Khan, S Falina… - Crystals, 2022‏ - mdpi.com
A new generation of high-efficiency power devices is being developed using wide bandgap
(WBG) semiconductors, like GaN and SiC, which are emerging as attractive alternatives to …

GaN-on-Si power technology: Devices and applications

KJ Chen, O Häberlen, A Lidow… - … on Electron Devices, 2017‏ - ieeexplore.ieee.org
In this paper, we present a comprehensive review and discussion of the state-of-the-art
device technology and application development of GaN-on-Si power electronics. Several …

Gallium nitride-based complementary logic integrated circuits

Z Zheng, L Zhang, W Song, S Feng, H Xu, J Sun… - Nature …, 2021‏ - nature.com
Owing to its energy efficiency, silicon complementary metal–oxide–semiconductor (CMOS)
technology is the current driving force of the integrated circuit industry. Silicon's narrow …

The 2018 GaN power electronics roadmap

H Amano, Y Baines, E Beam, M Borga… - Journal of Physics D …, 2018‏ - iopscience.iop.org
Gallium nitride (GaN) is a compound semiconductor that has tremendous potential to
facilitate economic growth in a semiconductor industry that is silicon-based and currently …

[HTML][HTML] An overview of normally-off GaN-based high electron mobility transistors

F Roccaforte, G Greco, P Fiorenza, F Iucolano - Materials, 2019‏ - mdpi.com
Today, the introduction of wide band gap (WBG) semiconductors in power electronics has
become mandatory to improve the energy efficiency of devices and modules and to reduce …

2.7 kV Low Leakage Vertical PtOx/β-Ga2O3 Schottky Barrier Diodes With Self-Aligned Mesa Termination

Z Han, G Jian, X Zhou, Q He, W Hao… - IEEE Electron …, 2023‏ - ieeexplore.ieee.org
In this study, we fabricated superb-Ga2O3 Schottky barrier diodes (SBDs) with high
breakdown voltage (and low leakage through combining platinum oxide (PtO and anodic …

Dynamic on-resistance in GaN power devices: Mechanisms, characterizations, and modeling

S Yang, S Han, K Sheng… - IEEE Journal of Emerging …, 2019‏ - ieeexplore.ieee.org
Gallium nitride (GaN) power devices enable power electronic systems with enhanced power
density and efficiency. Dynamic on-resistance (R ON) degradation (or current collapse) …

p-GaN Gate HEMT With Surface Reinforcement for Enhanced Gate Reliability

L Zhang, Z Zheng, S Yang, W Song… - IEEE Electron Device …, 2020‏ - ieeexplore.ieee.org
By deploying a surface reinforcement layer (SRL) at the interface between Schottky metal
and p-GaN in the gate stack, a p-GaN gate high-electron-mobility transistor (HEMT) with …

Frequency- and Temperature-Dependent Gate Reliability of Schottky-Type -GaN Gate HEMTs

J He, J Wei, S Yang, Y Wang, K Zhong… - IEEE Transactions on …, 2019‏ - ieeexplore.ieee.org
In this paper, we carried out a systematic investigation on gate degradation and the physical
mechanism of the Schottky-type p-GaN gate HEMTs under positive gate voltage stress. The …

Novel in-situ AlN/p-GaN gate HEMTs with threshold voltage of 3.9 V and maximum applicable gate voltage of 12.1 V

Y Wu, S Liu, J Zhang, S Zhao, X Li… - … on Electron Devices, 2023‏ - ieeexplore.ieee.org
In this article, we demonstrate a novel E-mode HEMT featuring in situ AlN dielectric layer on
p-GaN cap layer. Compared with conventional p-GaN gate HEMT, the threshold voltage of in …