Much effort in the area of electronics thermal management has focused on develo**
cooling solutions that cater to steady-state operation. However, electronic devices are …

Three-dimensional integrated circuits (3-D IC) technology has emerged in the past few
decades, driven in part by the techno-economic difficulties of dimensional scaling and the …

Evaporation of liquid is important in a diverse range of engineering applications, such as ink-
jet printing, pesticide spraying, micro-and nanofabrication, thin-film coatings, biochemical …

Phase change materials (PCM) used to buffer temperature swings in electronic devices
have the potential to improve reliability and shrink the volume and weight of the thermal …

Hotspot cooling is critical to the performance and reliability of electronic devices, but existing
techniques are not very effective in managing mobile hotspots. We report a hotspot cooling …

The development of wide band-gap power electronics over the last two decades has
stimulated a tremendous amount of research into high-performance liquid cooling solutions …

The Intrachip Enhanced Cooling Fundamentals (ICECool Fun) effort was launched by the
Defense Advanced Research Projects Agency (DARPA) under the leadership of Dr. Avram …

Interfacial behaviour and thermal performance of a 4-loop micro pulsating heat pipe are
examined through experiments performed at different filling ratio (30–60%), working fluid …

Successful utilization of the inherent capability of wide bandgap materials and architectures
for radio frequency (RF) power amplifiers (PAs) necessitates the creation of an alternative …

The presence of variable heat fluxes, such as localized hotspots in integrated circuit (IC)
architectures poses a key challenge for thermal management of existing (2D) and emerging …