Peripheral such as aerospace, armor, sensors, heat exchanger, automobile, storage, and
any other electronic equipment are frequently subjected to varying mechanical and thermal …

In the recent past, significant research effort has been dedicated to examining the usage of
nanomaterials hybridized with lignocellulosic fibers as reinforcement in the fabrication of …

The effective dissipation of heat is critical to the performance and longevity of high-power
electronics, so it is important to prepare highly thermally conductive polymer-based …

The novel three-dimensional (3D) co-doped carbon foam was fabricated via a facile
hydrothermal and subsequent pyrolysis process using fish skin as carbon precursor. The …

In this research, the role of prickly pear short fiber and red onion peel wrinkled biocarbon
nanosheets toughened epoxy resin composite was investigated. The main aim of this …

Novel hetero-structured silicon carbide-boron nitride nanosheets (SiC-BNNS) by sol-gel and
in-situ growth method were performed as thermally conductive & insulating fillers, and the …

MoSe 2 is a compelling narrow-band-gap semiconductor with particular lamellar crystal
structure, but which is rarely used as microwave absorber filler. Owing to the analogue …

The layered structure with large specific area and moderate conductivity endow MXene with
desired properties for microwave absorption. To date, oxidation of two dimensional (2D) Ti 3 …

We report the preparation of epoxy-based composites with enhanced dielectric properties
and thermal conductivity, by employing intelligently designed core/shell Alumina …

High toughness epoxy bio composites were prepared using caryota urens fibre and biochar
particle for light weight and low cost engineering applications. The main aim of this research …