Progress review of electromagnetic compatibility analysis technologies for packages, printed circuit boards, and novel interconnects
The ever-increasing demands of digital computing and wireless communication have been
driving the semiconductor technology to change with each passing day. Modern electronic …
driving the semiconductor technology to change with each passing day. Modern electronic …
Recent advances in thermal metamaterials and their future applications for electronics packaging
Thermal metamaterials exhibit thermal properties that do not exist in nature but can be
rationally designed to offer unique capabilities of controlling heat transfer. Recent advances …
rationally designed to offer unique capabilities of controlling heat transfer. Recent advances …
Forced convective interlayer cooling in vertically integrated packages
The heat removal capability of area-interconnect-compatible interlayer cooling in vertically
integrated, high-performance chip stacks was characterized with de-ionized water as …
integrated, high-performance chip stacks was characterized with de-ionized water as …
Method and system for facilitating floorplanning for 3D IC
(54) METHOD AND SYSTEM FOR FACILITATING OTHER PUBLICATIONS
FLOORPLANNING FOR 3D C Healy et al.,“Multiobjective Microarchitectural Floorplanning …
FLOORPLANNING FOR 3D C Healy et al.,“Multiobjective Microarchitectural Floorplanning …
Interlayer cooling potential in vertically integrated packages
The heat-removal capability of area-interconnect-compatible interlayer cooling in vertically
integrated, high-performance chip stacks was characterized with de-ionized water as …
integrated, high-performance chip stacks was characterized with de-ionized water as …
Power delivery design for 3-D ICs using different through-silicon via (TSV) technologies
3-D integrated circuits promise high bandwidth, low latency, low device power, and a small
form factor. Increased device density and asymmetrical packaging, however, renders the …
form factor. Increased device density and asymmetrical packaging, however, renders the …
[LIVRO][B] Modeling and design of electromagnetic compatibility for high-speed printed circuit boards and packaging
XC Wei - 2017 - taylorfrancis.com
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit
Boards and Packaging presents the electromagnetic modelling and design of three major …
Boards and Packaging presents the electromagnetic modelling and design of three major …
Thermal TSV optimization and hierarchical floorplanning for 3-D integrated circuits
While 3-D integrated circuits (ICs) offer many advantages over 2-D ICs, thermal
management challenges remain unresolved. Thermal through-silicon-vias (TTSVs) are …
management challenges remain unresolved. Thermal through-silicon-vias (TTSVs) are …
Three-dimensional integrated circuit design
To the observer, it would appear that New York city has a special place in the hearts of
integrated circuit (IC) designers. Manhattan geometries, which mimic the blocks and streets …
integrated circuit (IC) designers. Manhattan geometries, which mimic the blocks and streets …
Exploring serial vertical interconnects for 3D ICs
S Pasricha - Proceedings of the 46th Annual Design Automation …, 2009 - dl.acm.org
Three-dimensional integrated circuits (3D ICs) offer a promising solution to overcome the on-
chip communication bottleneck and improve performance over traditional two-dimensional …
chip communication bottleneck and improve performance over traditional two-dimensional …