Recent advances in semiconductor technology offer vertical interconnect access (via) that
extend through silicon, popularly known as through silicon via (TSV). This book provides a …

An integrated circuit (IC), or chip, is a set of electronic circuits and components placed on a
tiny planar silicon (Si) semiconductor substrate. These electronics circuits and components …

The emerging VLSI technology and simultaneously highly dense packaging of devices and
interconnects in nano-scale chips have prosperously enabled realization of system-on-chip …

This study explores the potential of randomly mixed carbon nanotube bundle (RMCB) as a
viable on-chip interconnect. Achieving high-quality carbon nanotubes (CNTs) with uniform …

This paper presents an efficient optimization strategy based on the Stoyan and Yaskov
algorithm to maximize the tube density of randomly distributed mixed carbon nanotube …

Fe 3+ is effective for improving water splitting and decreasing voltage drop of bipolar
membranes (BPMs), but such systems suffer from Fe 3+ loss during electrolysis. In the …

In recent past, the cross‐coupling crosstalk becomes a dominating factor due to the closer
proximity of wire that reduces the performance of coupled interconnects at lower technology …

In the field of VLSI technology, the miniaturization of ICs poses significant challenges to
overall interconnect performance, particularly due to the rising concerns of crosstalk-induced …

In this paper, we propose transmission gates (TGs) as buffers/repeaters for carbon nanotube
(CNT)-based VLSI interconnects. Various performance metrics of the TG buffer, viz …

The size reduction of copper interconnects degrades their performances due to increased
surface scattering, which significantly reduces the effective electron mean free path. Unlike …