Pb-based solders have been the cornerstone technology of electronic interconnections for
many decades. However, with legislation in the European Union and elsewhere having …

Lead free solders are increasingly being used in electronic applications. Eutectic Sn–Cu
solder alloy is one of the most favored lead free alloys used for soldering in electronic …

Purpose This paper aims to study the effect of different Ni content on the microstructure and
properties of Sn-0.7 Cu alloy. Then, the spreading area, wetting angle, interface layer …

Abstract Fracture tests on Sn93Pb37 solder joints in a double cantilever beam (DCB)
configuration were performed at two different strain rates of 10− 5 and 0.03 s− 1 under mode …

Finding the optimized set of manufacturing parameters to produce strong solder-copper
connections requires investigating the main and interaction effects of processing variables …

The reliability of electronic packages is primarily affected by the growth of the intermetallic
compound (IMC) between the solder and the copper interconnection. It is therefore …

The aim of this research paper is to study the effects of cooling rates on microstructure and
mechanical properties of Sn3. 8Ag0. 7Cu solder alloy prepared through powder metallurgy …

Microwave hybrid heating (MHH) has been recognized for the soldering process especially
with lead-free solder alloy. This study seeks to investigate the effect of the different amount of …

In this paper, the effects of Cu content on the interfacial reactions of Sn-xCu/Cu solder joints
were systematically investigated. The examined Cu compositions varied from 0.98 wt% to …

Besides the popular reflow soldering practice, wave soldering is another established
technique in the electronic packaging industry for obtaining the solder joints. In this study the …