Fiber-to-Chip Packaging with Robust Fiber Fusion Splicing for Low-Temperature Applications
Photonic Integrated Circuits (PICs) have emerged as a promising technology to support
applications including datacom, AI, RF signal processing, and quantum computing and …
applications including datacom, AI, RF signal processing, and quantum computing and …
Fiber optical coupling with engineered scattering elements
IZ Sukovaty, TV Howard… - Optical Interconnects …, 2023 - spiedigitallibrary.org
Optical interconnects using a silicon-on-insulator integrated circuit platform have become
the basis for many modern communications platforms. One limiting factor in interconnect …
the basis for many modern communications platforms. One limiting factor in interconnect …