Interfacial thermal resistance: Past, present, and future

J Chen, X Xu, J Zhou, B Li - Reviews of Modern Physics, 2022 - APS
Interfacial thermal resistance (ITR) is the main obstacle for heat flows from one material to
another. Understanding ITR becomes essential for the removal of redundant heat from fast …

Advances on thermally conductive epoxy‐based composites as electronic packaging underfill materials—a review

Y Wen, C Chen, Y Ye, Z Xue, H Liu, X Zhou… - Advanced …, 2022 - Wiley Online Library
The integrated circuits industry has been continuously producing microelectronic
components with ever higher integration level, packaging density, and power density, which …

Thermoelectric devices: a review of devices, architectures, and contact optimization

R He, G Schierning, K Nielsch - Advanced Materials …, 2018 - Wiley Online Library
In recent years, the substantially improved performance of thermoelectric (TE) materials has
attracted considerable interest in studying the potential applications of the TE technique …

A review of experimental and computational advances in thermal boundary conductance and nanoscale thermal transport across solid interfaces

A Giri, PE Hopkins - Advanced Functional Materials, 2020 - Wiley Online Library
Interfacial thermal resistance is the primary impediment to heat flow in materials and devices
as characteristic lengths become comparable to the mean‐free paths of the energy carriers …

[HTML][HTML] Nanoscale thermal transport. II. 2003–2012

DG Cahill, PV Braun, G Chen, DR Clarke… - Applied physics …, 2014 - pubs.aip.org
A diverse spectrum of technology drivers such as improved thermal barriers, higher
efficiency thermoelectric energy conversion, phase-change memory, heat-assisted magnetic …

Enhancement of interfacial thermal conductance by introducing carbon vacancy at the Cu/diamond interface

K Wu, L Zhang, F Li, L Sang, M Liao, K Tang, J Ye… - Carbon, 2024 - Elsevier
Effective heat dissipation of semiconductor devices is crucial for their extended lifespan and
operational stability, and the interface of semiconductors provides an effective window for …

Thermal boundary conductance: A materials science perspective

C Monachon, L Weber, C Dames - Annual Review of Materials …, 2016 - annualreviews.org
The thermal boundary conductance (TBC) of materials pairs in atomically intimate contact is
reviewed as a practical guide for materials scientists. First, analytical and computational …

Role of anharmonic phonon scattering in the spectrally decomposed thermal conductance at planar interfaces

K Sääskilahti, J Oksanen, J Tulkki, S Volz - Physical Review B, 2014 - APS
A detailed understanding of the vibrational heat transfer mechanisms between solids is
essential for the efficient thermal engineering and control of nanomaterials. We investigate …

Enhancing phonon transmission across a Si/Ge interface by atomic roughness: First-principles study with the Green's function method

Z Tian, K Esfarjani, G Chen - Physical Review B—Condensed Matter and …, 2012 - APS
Knowledge on phonon transmittance as a function of phonon frequency and incidence
angle at interfaces is vital for multiscale modeling of heat transport in nanostructured …

Interface controlled thermal resistances of ultra-thin chalcogenide-based phase change memory devices

K Aryana, JT Gaskins, J Nag, DA Stewart, Z Bai… - Nature …, 2021 - nature.com
Phase change memory (PCM) is a rapidly growing technology that not only offers
advancements in storage-class memories but also enables in-memory data processing to …