The lack of effective methods to develop the product, process and operation models based
on virtual and physical convergence leads to the poor performance on intelligence, real-time …

The technology of big data analysis and artificial intelligence deep learning has been
actively cross-combined with various fields to increase the effect of its original low single …

Defect pattern recognition (DPR) of wafer maps is critical for determining the root cause of
production defects, which can provide insights for the yield improvement in wafer foundries …

Multi-skill resource-constrained project scheduling problem (MS-RCPSP) is one of the most
investigated problems in operations research and management science. In this paper, a …

Identification of the defective patterns of the wafer maps can provide insights for the quality
control in the semiconductor wafer fabrication systems (SWFSs). In real SWFSs, the …

One of the most significant advances in the development of intelligent manufacturing is
represented by the industrial Internet, which is combining the physical and cyber …

Cyber physical system (CPS) enables companies to keep high traceability and controllability
in manufacturing for better quality and improved productivity. However, several challenges …

Defect detection is a critical measurement process for intelligent manufacturing systems to
provide insights for product quality improvement. For complex products such as integrated …

Estimating the cycle time ranges of jobs is a critical task in a factory. this study proposes a
fuzzy collaborative intelligence (FCI) approach to improve the precision of cycle time range …

The ability to predict the remaining cycle-time in industrial environments is of major concern
among production managers. An accurate prediction would enable managers to handle …