Epoxy resins with a high dielectric constant and low intrinsic thermal conductivity coefficient
cannot meet the current application requirements of advanced electronic and electrical …

In this work, a novel dicarboxylic acid (TB–COOH) containing Tröger's base (TB) was
synthesized, and newly TB-based polybenzimidazole (PBI) membranes were prepared as …

With the rapid development of 5G communications, the traditional interlayer dielectric
material polyimide (PI) requires modification due to its intrinsically high dielectric constant (D …

The development of microelectronics and large-scale intelligence nowadays promotes the
integration, miniaturization, and multifunctionality of electronic and devices but also leads to …

Polyimides are ideal candidates for 5G high-frequency communications due to their good
thermal stability, mechanical properties and processability. However, the exploration of how …

To ensure the stable performance and extended service life of high-integrity and high-power
electronic devices, it is imperative for dielectric materials to consistently exhibit a low …

The development of polyimide (PI) films with excellent mechanical properties and low
dielectric constants is crucial for flexible optoelectronic devices and printed circuit boards …

Polyimides (PIs) are essential materials for electronic and high-frequency communication
applications, often face challenges with high dielectric loss. Drawing inspiration from low …

Low dielectric constant (low-k, k< 2.5) thermoset polymers play a crucial role in high-
frequency communication technology and the microelectronic industry. However, existing …

High-performance polyimides (PIs) have attracted lots of interest in recent years and can be
divided into categories such as colorless, low-dielectric, high thermal stability, etc …