A roadmap review of thermally conductive polymer composites: critical factors, progress, and prospects
Recently, the need for miniaturization and high integration have steered a strong technical
wave in develo** (micro‐) electronic devices. However, excessive amounts of heat may …
wave in develo** (micro‐) electronic devices. However, excessive amounts of heat may …
Emerging interface materials for electronics thermal management: experiments, modeling, and new opportunities
Thermal management is becoming a critical technology challenge for modern electronics
with decreasing device size and increasing power density. One key materials innovation is …
with decreasing device size and increasing power density. One key materials innovation is …
Flexible thermal interface based on self-assembled boron arsenide for high-performance thermal management
Thermal management is the most critical technology challenge for modern electronics.
Recent key materials innovation focuses on develo** advanced thermal interface of …
Recent key materials innovation focuses on develo** advanced thermal interface of …
Idealizing Tauc plot for accurate bandgap determination of semiconductor with ultraviolet–visible spectroscopy: a case study for cubic boron arsenide
The Tauc plot is widely used to determine the bandgap of semiconductors, but the actual
plot often exhibits significant baseline absorption below the expected bandgap, leading to …
plot often exhibits significant baseline absorption below the expected bandgap, leading to …
Integration of boron arsenide cooling substrates into gallium nitride devices
Thermal management is critical in modern electronic systems. Efforts to improve heat
dissipation have led to the exploration of novel semiconductor materials with high thermal …
dissipation have led to the exploration of novel semiconductor materials with high thermal …
Advances in thermal conductivity for energy applications: a review
Thermal conductivity is a crucial material property for a diverse range of energy
technologies, ranging from thermal management of high power electronics to thermal …
technologies, ranging from thermal management of high power electronics to thermal …
Wafer-scale bonded GaN–AlN with high interface thermal conductance
Wide and ultrawide bandgap semiconductors, such as GaN, play a crucial role in high-
power applications, yet their performance is often constrained by thermal management …
power applications, yet their performance is often constrained by thermal management …
Effects of impurities on the thermal and electrical transport properties of cubic boron arsenide
Cubic boron arsenide (BAs) is a promising compound semiconductor for thermal
management applications due to its high thermal conductivity, exceeding 1000 W m–1 K–1 …
management applications due to its high thermal conductivity, exceeding 1000 W m–1 K–1 …
A MoS2/BAs heterojunction as photodetector
G **ong, J Lu, R Wang, Z Lin, S Lu, J Li, Z Tong… - Materials Today …, 2024 - Elsevier
With high thermal conductivity and carrier mobility, cubic boron arsenide (BAs) shows huge
potential in high-power and high-speed optoelectronic devices. However, researches about …
potential in high-power and high-speed optoelectronic devices. However, researches about …
Anomalous thermal transport under high pressure in boron arsenide
High pressure represents extreme environments and provides opportunities for materials
discovery,,,,,,–. Thermal transport under high hydrostatic pressure has been investigated for …
discovery,,,,,,–. Thermal transport under high hydrostatic pressure has been investigated for …